Segmented Flow Channels for Semiconductor Light Source Cooling
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Solution Overview
Problem
Existing methods for cooling semiconductor light-emitting elements in projection display devices face challenges in efficiently dissipating heat due to increased ventilation resistance and airflow issues when using a single heat fin for multiple elements, especially with high-brightness light sources that generate more heat.
Innovation Solution
A light source device with semiconductor light-emitting elements arranged in rows and columns, where flow channels are formed to sandwich the elements, allowing a cooling medium to flow through and effectively dissipate heat, thereby improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If one heat dissipating fin is used for multiple semiconductor light-emitting elements, then device complexity is reduced, but ventilation resistance increases and cooling efficiency deteriorates
Solution Approach 1:
The single heat dissipating fin structure is divided into multiple separate fins, with each fin dedicated to cooling specific semiconductor light-emitting elements. This segmentation reduces ventilation resistance by creating multiple independent airflow paths, thereby improving cooling efficiency while maintaining manageable device complexity through modular design
Solution Approach 2:
The patent transitions from a two-dimensional planar fin arrangement to a three-dimensional structure where fins are positioned at different heights and angles. This dimensional change allows airflow to pass through multiple levels, reducing ventilation resistance and improving heat dissipation effectiveness without proportionally increasing the number of fins
2Illumination intensity
If semiconductor light-emitting elements are arranged in high-density configuration, then brightness is increased, but heat dissipation becomes more difficult
Solution Approach 1:
The patent implements a nested cooling structure where heat dissipating fins are positioned within and around the array of semiconductor light-emitting elements. The fins are integrated into the mounting substrate structure, creating a nested arrangement where cooling channels are embedded among the light-emitting elements, enabling effective heat removal from high-density configurations
Solution Approach 2:
The patent introduces heat dissipating fins as intermediary structures between the semiconductor light-emitting elements and the ambient environment. These fins serve as thermal mediators that conduct heat away from the densely packed elements and transfer it to the airflow, effectively decoupling the high-density element arrangement from direct thermal interference
3Area of stationary object
If heat dissipating fin length is increased to cool multiple elements, then cooling coverage is improved, but ventilation resistance increases and airflow is blocked
Solution Approach 1:
Instead of using one long fin to cover multiple elements, the patent segments the cooling function into multiple shorter fins distributed across the element array. Each fin has optimized length to avoid excessive ventilation resistance while collectively providing comprehensive cooling coverage through their distributed arrangement
Solution Approach 2:
The patent extends cooling coverage by adding vertical and angular dimensions to the fin structure. Rather than relying solely on increased horizontal length, fins are positioned at different heights and angles, creating a three-dimensional cooling network that covers multiple elements without requiring excessively long individual fins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient cooling of multiple semiconductor light-emitting elements, maintaining performance and extending their lifespan by effectively managing heat dissipation and reducing ventilation resistance.
Implementation Method 1
a plurality of flow channels where a cooling medium flows through, the plurality of flow channels being formed to sandwich the n rows of semiconductor light-emitting elements or the m columns of semiconductor light-emitting elements
Data Source
AI summary
A plurality of semiconductor light-emitting elements are to be efficiently cooled. There are provided a plurality of semiconductor light-emitting elements that are arranged in n rows and m columns, and a plurality of flow channels where a cooling medium flows through, the plurality of flow channels being formed to sandwich the n rows of semiconductor light-emitting elements or the m columns of semiconductor light-emitting elements.