Segmented Fluid Discharge Head for Uniform Wafer Coating
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Solution Overview
Problem
Existing fluid discharge devices face challenges in uniformly applying fluid to large workpieces, such as silicon wafers of 300 mm, due to non-uniform pressure distribution and deformation of masks, leading to unstable fluid discharge and overlapping patterns.
Innovation Solution
The use of reciprocating discharge heads and split head units, with each head unit being 1/2 to 1/4 the lateral length of the workpiece, allows for uniform pressure distribution and synchronized horizontal movement to prevent deformation and overlapping, ensuring stable fluid application across the workpiece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a discharge head of the same size as the workpiece is used, then the mask deformation is reduced, but the pressure distribution becomes non-uniform and fluid discharge becomes unstable
Solution Approach 1:
The discharge head is divided into multiple independent discharge units (first discharge unit and second discharge unit) that can operate separately. Each unit covers a specific region of the workpiece, allowing uniform pressure distribution across different areas while preventing mask deformation through localized contact
2Device complexity
If a single discharge head is used, then the device complexity is reduced, but the fluid application coverage and efficiency decrease
Solution Approach 1:
The discharge head is segmented into multiple independent discharge units that can be positioned at different locations. The first discharge unit applies fluid to a first region while the second discharge unit applies fluid to a second region, enabling simultaneous multi-area coverage and improving productivity
Solution Approach 2:
The invention transitions from a single discharge head operating in one location to multiple discharge units operating across different spatial dimensions and regions of the workpiece, effectively utilizing the two-dimensional surface area for parallel fluid application
3Stability of the object's composition
If the discharge head moves in a fixed direction, then the mask deformation is minimized, but the scanning operations increase and productivity decreases
Solution Approach 1:
By dividing the discharge head into multiple units positioned at different locations, each unit can service its designated region with minimal movement. This segmentation reduces the total scanning distance required compared to a single discharge head that must traverse the entire workpiece surface
Data Source
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AI summary
In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.