Segmented Metal Frame for Antenna Isolation and Heat Dissipation
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Solution Overview
Problem
Wearable electronic devices face challenges in effectively dissipating heat generated during communication due to their compact size, where the metal frame is often used as both an antenna and a conductor, leading to inadequate heat dissipation.
Innovation Solution
The electronic device incorporates a segmented metal frame where a non-conductive segmentation member separates the frame into an antenna portion and a heat sink portion, utilizing thermal interface materials for efficient heat transfer from the heating elements to the exterior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal frame is used as an antenna to provide communication function, then antenna performance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The metal frame is divided into multiple segments with different functions: one segment serves as an antenna for communication while another segment acts as a heat sink for thermal dissipation. This segmentation allows each portion to be optimized for its specific function without interfering with the other, resolving the contradiction between antenna performance and heat dissipation.
Solution Approach 2:
Different portions of the metal frame are assigned different functional properties: the antenna portion is optimized for electromagnetic radiation and reception, while the heat sink portion is optimized for thermal conduction and dissipation. This local differentiation of quality allows the same component (metal frame) to simultaneously address both communication and thermal management requirements.
2Temperature
If the metal frame is segmented into antenna portion and heat sink portion, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The metal frame serves multiple functions: it provides structural support, acts as an antenna for communication, and functions as a heat sink for thermal dissipation. By making the frame multi-functional, the design avoids adding separate components for each function, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Solution Approach 2:
The structural frame, antenna, and heat sink functions are merged into a single integrated component (the metal frame). This consolidation reduces the number of separate parts and assembly steps, minimizing the increase in device complexity despite the functional segmentation required for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance while maintaining antenna functionality, improving communication time by 71% compared to devices without this heat dissipation path.
Implementation Method 1
the second metal portion may be connected to the heating element using heat transfer members comprising a thermal interface material
Data Source
AI summary
In various embodiments, an electronic device may comprise: a housing including a front plate, a rear plate opposite to the front plate, and a side frame surrounding the space between the front plate and the rear plate; and a printed circuit board disposed in the space and having a front end module (FEM) and a heating element comprising a thermally conductive material mounted thereon, wherein the side frame is segmented into at least a first metal portion and a second metal portion, a segmentation member comprising a non-conductive material is disposed between the first metal portion and the second metal portion, and the first metal portion is electrically connected to the front end module, and the second metal portion is connected to the heating element by heat transfer members comprising a thermal interface material.