Segmented Frame Structure for Warpage-Tolerant Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor devices face issues with warpage in the base plate due to thermal expansion coefficient differences between the insulating substrate and the base plate, leading to connectivity failures of the frame.
Innovation Solution
The semiconductor device incorporates a frame with a first frame portion that is divided into multiple elastic portions, allowing for elastic deformation from an inclined state to a parallel state, ensuring secure connectivity to the conductive pattern while reducing the frame's rigidity to prevent pulling failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the length of the frame is increased to reduce clearance and secure connectivity, then connectivity of the frame is improved, but rigidity of the frame increases causing pulling failures during fitting
Solution Approach 1:
The first frame portion is divided into multiple divided portions, creating a segmented structure that allows individual sections to deform independently while maintaining overall connectivity. This segmentation reduces the frame's overall rigidity, preventing pulling failures during fitting while preserving electrical connectivity.
Solution Approach 2:
The frame is designed with elastic portions that can dynamically deform from a first state (inclined, lower than connection surface) to a second state (parallel to connection surface) in response to thermal expansion and mechanical stress. This dynamic adaptability allows the frame to maintain connectivity under varying conditions without requiring excessive rigidity.
2Stability of the object's composition
If the frame is made more rigid to maintain structural integrity, then structural stability is improved, but the frame cannot adapt to warpage in the base plate, causing connectivity failures
Solution Approach 1:
By dividing the first frame portion into multiple segments, the structure maintains local flexibility at each divided portion while preserving overall structural integrity. Each divided portion can independently adapt to warpage, preventing connectivity failures while maintaining structural stability.
Solution Approach 2:
The frame incorporates elastic portions with controlled flexibility that can deform to follow base plate warpage. These elastic portions act as flexible elements that adapt to dimensional changes in the base plate due to thermal expansion, ensuring continuous connectivity without compromising the frame's structural integrity.
3Adaptability or versatility
If the frame length is increased to compensate for base plate warpage, then adaptability to warpage is improved, but the frame becomes more prone to pulling failures due to high rigidity
Solution Approach 1:
The segmented structure of the first frame portion allows the frame to achieve adaptability to warpage through distributed flexibility across multiple divided portions. This segmentation prevents stress concentration that would lead to pulling failures, enabling the frame to accommodate base plate warpage while maintaining fitting reliability.
Solution Approach 2:
The elastic portions enable the frame to dynamically adjust its configuration in response to base plate warpage. The frame transitions between different states (inclined to parallel) based on thermal and mechanical conditions, providing adaptability without the excessive rigidity that causes pulling failures during fitting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic frame portions maintain connectivity by adapting to warpage in the base plate, while reduced rigidity prevents pulling failures, thus ensuring reliable fitting of the base plate and case.
Implementation Method 1
at least one divided portion in the plurality of divided portions in the first frame portion is an elastic portion which can be elastically deformed from a first state where a tip end portion is inclined to be located on a lower side of the connection surface to a second state where the tip end portion extends in a direction parallel to the connection surface
Implementation Method 2
when a warpage occur, in the base plate in a high temperature state, the elastic portion returns from the second state to the first state by restoring force of the elastic portion, thereby following the warpage of the base plate
Implementation Method 3
a warpage occurs in a base plate due to a difference of a thermal expansion coefficient between an insulating substrate having a conductive pattern and the base plate
Data Source
AI summary
In a semiconductor device, a frame includes a first frame portion extending in a direction parallel to a connection surface to be connected to the connection surface and a second frame portion connecting a case and the first frame portion. The first frame portions are divided into a plurality of divided portions. At least one divided portion in the plurality of divided portions in the first frame portions is an elastic portion which can be elastically deformed from a first state where a tip end portion is inclined to be located on a lower side of the connection surface to a second state where the tip end portion extends in a direction parallel to the connection surface. The divided portion as the elastic portion is connected to the connection surface while being elastically deformed from the first state to the second state.