Segmented Electroplated Grinding Wheel for Cooling and Chip Removal
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Solution Overview
Problem
Existing electroplated grinding wheels face challenges in achieving effective cooling and chip removal due to limited water passing grooves and high manufacturing costs, with dense strip-shaped regions requiring cumbersome manufacturing processes.
Innovation Solution
An electroplated steel wire segment-combined grinding wheel design featuring a base component and steel wire segments plated with diamonds, forming drainage channels between segments for internal cooling and rapid chip removal, with a reusable base for cost-effective maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water passing grooves are densely machined in the base of electroplated grinding wheel, then cooling effect is improved, but manufacturing cost increases extremely high
Solution Approach 1:
The grinding wheel is divided into multiple independent steel wire segments that are assembled on a base. Each segment can be independently manufactured and assembled, replacing the need for complex machining of water passing grooves in a monolithic base. This segmentation achieves effective cooling channels without requiring extremely high manufacturing costs.
Solution Approach 2:
The steel wire segments are selectively assembled at specific positions on the base to form cooling channels only where needed. This localized approach creates effective cooling paths while avoiding unnecessary machining costs across the entire base structure.
2Temperature
If strip-shaped regions are shielded from being plated with diamonds to form water passing grooves, then cooling effect is improved, but manufacturing process becomes cumbersome and difficult
Solution Approach 1:
Instead of creating complex shielded regions on a continuous base, the design uses separate steel wire segments that are assembled together. The segments themselves form the cooling channels through their arrangement and gaps, eliminating the need for complex shielding and replating processes.
Solution Approach 2:
Rather than starting with a continuous base and removing material to create cooling channels, the invention starts with discrete segments that inherently provide cooling paths through their assembly. This inverts the traditional approach of subtractive manufacturing.
3Manufacturing precision
If diamond particle size is reduced to improve grinding precision, then grinding precision is improved, but water-passing and chip-accommodating space is reduced and cooling effect deteriorates
Solution Approach 1:
The segmented structure creates macro-scale cooling channels between segments that are independent of the diamond particle size. This allows the use of finer diamond particles for improved grinding precision while maintaining effective cooling through the segment gaps and associated drainage channels.
Solution Approach 2:
The cooling function is shifted from the two-dimensional plane of the grinding surface (where diamond particles are distributed) to the three-dimensional space between segments. This creates cooling channels in the radial and axial dimensions, providing adequate space for water passage and chip removal regardless of surface diamond particle size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates internally cooled type cooling and rapid chip removal, reduces renovation costs, and enables convenient replacement of grinding surfaces through a reusable base design.
Implementation Method 1
outer walls of the steel wire segments are plated with diamonds to form a grinding surface
Implementation Method 2
spaces between the segments and segment arcs and spaces formed by exposed diamond particles naturally form drainage channels between the segments and the segment arcs, and thus internally cooled type cooling and rapid chip removal are facilitated
Data Source
AI summary
An electroplated steel wire segment-combined grinding wheel includes a base component for connecting an external device, and steel wire segments, wherein the steel wire segments are combined and assembled on the base component in a ring, and outer walls of the steel wire segments are plated with diamonds to form a grinding surface. The steel wire segments are combined and assembled mechanically on a support base, wherein the support base is a reusable tool, and replacing the grinding surface combined by the steel wire segments is convenient for reducing a renovation cost of the electroplated steel wire segment-combined grinding wheel. For the electroplated steel wire segment-combined grinding wheel, drainage channels are naturally formed between the steel wire segments and segment arcs, and thus, internally cooled type cooling and rapid chip removal are facilitated.