Segmented Grinding Wheel for Uniform Substrate Flatness
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Solution Overview
Problem
Existing grinding methods for multiple platelike substrates, such as sapphire or SiC, often result in the peripheral areas being ground more than the central areas, leading to uneven work surfaces.
Innovation Solution
A grinding method using a grinding wheel with a disk-shaped base featuring annularly arranged first and second abrasive members, where the radial spacing between these members is set larger than the minimum spacing between substrates, allowing for distributed grinding pressure to prevent over-grinding of peripheral areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are ground at the same time using conventional grinding methods, then productivity is improved, but the peripheral portion of each substrate is ground more than the central portion, resulting in uneven work surfaces
Solution Approach 1:
The grinding wheel is segmented into multiple independent abrasive members (first abrasive members and second abrasive members) arranged in different radial positions. Each abrasive member can independently contact and grind the substrates, distributing the grinding action across multiple points to achieve uniform surface flatness while maintaining high productivity.
Solution Approach 2:
Different regions of the grinding wheel are designed with different properties: first abrasive members are arranged at the outer periphery while second abrasive members are arranged at the inner radius. This spatial differentiation allows each region to serve its specific grinding function, with the radial spacing configured to prevent excessive grinding pressure on peripheral substrates while ensuring adequate contact with central substrates.
2Productivity
If the radial spacing between abrasive members is reduced to increase grinding coverage, then productivity is improved, but the peripheral portion of substrates experiences excessive grinding pressure causing uneven surfaces
Solution Approach 1:
The problem is solved by utilizing the radial dimension of the grinding wheel. Instead of only adjusting the angular spacing of abrasive members, the invention arranges abrasive members at different radial distances from the center (first abrasive members at outer periphery, second abrasive members at inner radius). This two-dimensional arrangement allows the peripheral substrates to be ground by outer abrasive members while central substrates are ground by inner abrasive members, distributing pressure uniformly across all substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively flattens the entire work surface of each substrate by reducing grinding pressure on the periphery, ensuring even grinding of multiple substrates simultaneously.
Implementation Method 1
grinding means having a grinding wheel for grinding the platelike workpieces
Data Source
AI summary
A grinding method for grinding a plurality of platelike workpieces at a time is provided. The workpieces are attached to a support member and held on a chuck table. A grinding wheel is brought into contact with the workpieces to grind the workpieces at a time. The grinding wheel includes a disk-shaped wheel base having a first surface, a plurality of first abrasive members arranged annularly on the first surface of the wheel base, and a plurality of second abrasive members arranged annularly on the first surface of the wheel base radially inside the first abrasive members in a concentric relationship with the first abrasive members. The radial spacing between the first abrasive members and the second abrasive members is set larger than the minimum spacing between any adjacent ones of the workpieces.