Segmented Grounding Gasket for Right-Angle Micro-D Connectors

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Solution Overview

Problem

Existing connectors, such as right-angle micro-D connectors, lack built-in mechanisms for grounding their metal bodies to printed circuit boards, leading to unreliable grounding methods like thick conductive gaskets that deteriorate over time or introduce debris.

Innovation Solution

A conductive gasket with a deformable contact region and fastener region that provides compressive contact between the connector and PCB, featuring a keep-out zone for pins and secure fastening, made from materials like stainless steel or Be-Cu alloys for reliable electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive polymeric pastes or gaskets are used to ground the connector body to the PCB, then electrical continuity is established, but the gaskets become undesirably thick and require pressure-sensitive adhesive that deteriorates over time

Engineering Contradiction:
Improvegrounding reliabilityVSAvoidgasket thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The gasket is segmented into three distinct regions: a deformable contact region for electrical contact, a fastener region for mechanical attachment, and a keep-out zone to prevent short circuits. This segmentation allows each region to be optimized independently, enabling thin profile while maintaining grounding reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the gasket have different properties tailored to their specific functions. The deformable contact region has high conductivity and compliance for reliable electrical contact, the fastener region provides mechanical strength for attachment, and the keep-out zone provides insulation. This local differentiation eliminates the need for uniformly thick gaskets.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If pressure-sensitive adhesive is used to keep the gasket in place, then the gasket is easily installed, but the adhesive deteriorates over time leading to unreliable grounding

Engineering Contradiction:
Improveinstallation easeVSAvoidgrounding durability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The gasket combines mechanical fastening functionality with electrical grounding functionality in a single integrated component. The fastener region provides reliable mechanical attachment without requiring separate adhesives, while the deformable contact region provides electrical continuity. This merger eliminates the deterioration issues associated with pressure-sensitive adhesives.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conductive paste is used to ground the connector, then electrical continuity is achieved, but the paste may crack or chip away introducing debris into the system

Engineering Contradiction:
Improveelectrical continuityVSAvoiddebris generation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The deformable contact region is designed as a solid, monolithic structure that is more durable than conductive paste. While it may eventually wear, it does so without cracking or chipping like paste, and can be replaced as a single unit. This approach trades the initial cost of a more substantial component for long-term reliability and absence of debris generation.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Length of stationary object

If a thin gasket is used to establish ground path, then installation space is reduced, but the gasket may not provide sufficient compressive contact for reliable grounding

Engineering Contradiction:
Improvegasket thicknessVSAvoidcompressive contact reliability
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The deformable contact region is designed to be compliant and deformable, allowing it to dynamically adapt to surface irregularities and maintain reliable electrical contact even at thin profiles. This dynamic compliance compensates for the reduced thickness, ensuring sufficient compressive contact for grounding reliability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The gasket ensures a reliable and durable ground path between connectors and PCBs, preventing debris introduction and maintaining connectivity over time.

Implementation Method 1

a deformable contact region configured to provide compressive contact between the mounting surface of the connector and a grounded surface of the substrate

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP2446508B1Methods and apparatus for a grounding gasket
Publication Date: 2015.04.01 RAYTHEON CO
  • EP2446508B1 patent drawingFigure 1~4
  • EP2446508B1 patent drawingFigure 5~6
  • EP2446508B1 patent drawingFigure 7~9

AI summary

A conductive gasket includes a deformable contact region configured to provide compressive contact between the mounting surface of a connector (e.g., a right-angle micro-D connector) and a grounded surface of the substrate (e.g., PCB). A fastener region extends from the deformable contact region and is configured to align with a mounting region of the connector. A keep-out zone is provided adjacent to the deformable contact region and the fastener region and is configured to allow the pins of the connector to pass therethrough.