Segmented Guard Ring with Resistance Layer for Signal Leakage
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing the influence of signal leakage from signal pads to guard rings, which can propagate and degrade circuit performance.
Innovation Solution
A semiconductor device design featuring a metal guard ring with interruptions and a resistance layer connecting these interruptions, along with an outer guard ring, to attenuate signal leakage and prevent water infiltration, while maintaining manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a continuous guard ring is provided outside the periphery of a circuit region, then water infiltration into the circuit region is suppressed, but signal leakage from the signal pad to the guard ring propagates through the guard ring and degrades circuit performance
Solution Approach 1:
The guard ring is divided into multiple segments by introducing openings, transforming it from a continuous structure to a discontinuous one. This segmentation prevents signal leakage from propagating through the guard ring while the segments still collectively block water infiltration into the circuit region.
Solution Approach 2:
A resistance layer is introduced as an intermediary component to connect the interrupted guard ring segments. This resistance layer has high electrical resistance that attenuates signal leakage while maintaining electrical connectivity, and it also provides mechanical continuity to prevent water infiltration.
2Object-generated harmful factors
If openings are introduced in the guard ring to reduce signal leakage propagation, then signal leakage influence is reduced, but water infiltration suppression capability is weakened
Solution Approach 1:
The resistance layer serves as a mediator that fills the openings in the guard ring. It provides electrical attenuation for signal leakage while simultaneously providing physical continuity to block water infiltration paths, thus resolving the contradiction between signal suppression and water protection.
Solution Approach 2:
The guard ring structure is transformed into a composite system combining metal guard ring segments with a resistance layer material. This composite structure leverages the electrical properties of the resistance layer for signal attenuation while maintaining the physical barrier function against water infiltration.
3Object-generated harmful factors
If a resistance layer is used to connect interrupted guard ring ends, then signal leakage is attenuated, but manufacturing complexity increases
Solution Approach 1:
The resistance layer formation process is merged with the existing guard ring fabrication process. The resistance layer is formed in the same processing steps as the guard ring, combining multiple functions into a single integrated structure and avoiding additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces signal leakage influence on the circuit region, suppresses water infiltration, and maintains manufacturing efficiency by using a resistance layer to attenuate signals and a double guard ring structure.
Implementation Method 1
a resistance layer that connects ends of the first guard ring interrupted by the one or the plurality of openings to each other
Data Source
AI summary
A semiconductor device includes: a semiconductor substrate; a first metal ring which is provided outside a periphery of a circuit region including a signal pad on one surface side of the semiconductor substrate and is interrupted by one or a plurality of openings; a second metal ring provided outside a periphery of the first metal ring; and a resistance layer that connects ends of the first metal ring interrupted by the one or the plurality of openings to each other, wherein the first metal ring includes a first wall portion and a second wall portion that sandwich the circuit region, and a third wall portion and a fourth wall portion that sandwich the circuit region and are connected to the first wall portion and the second wall portion, and the one or the plurality of openings is arranged in the first wall portion close to the signal pad.