Segmented Heat-Conducting Chamber for High-Load Cooling Stability

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Solution Overview

Problem

Current three-dimensional heat transfer devices, such as vapor chambers and heat pipes, struggle to manage heat dissipation efficiently in high-speed computing technologies, leading to functional degradation and partial dry burning.

Innovation Solution

A high heat cooling device with a heat-conducting chamber body featuring a first and second chamber divided by an isolation ring, utilizing different cooling fluids and filling rates in primary and secondary hot zones, along with strategically positioned heat pipes for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If three-dimensional heat transfer devices (vapor chambers and heat pipes) are integrated to improve heat dissipation efficiency, then heat transfer capability is enhanced, but functional degradation and partial dry burning occur under high heat loads

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidfunctional stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The first chamber is divided into a primary hot zone and a secondary hot zone by an isolation ring, creating segmented regions with different cooling fluid filling rates. This segmentation allows each zone to be optimized independently for its specific heat load characteristics, preventing any single zone from experiencing dry burning while maintaining overall system reliability under high heat loads.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different zones within the first chamber are assigned different cooling fluid filling rates - the primary hot zone has a higher filling rate than the secondary hot zone. This local differentiation ensures that areas with higher heat generation (primary hot zone) have more cooling fluid available to prevent dry burning, while areas with lower heat generation (secondary hot zone) maintain appropriate fluid levels without overfilling.

Inventive Principle:
Principle #3Local quality

2Reliability

If cooling fluid filling rate is increased to prevent dry burning, then heat dissipation reliability improves, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveprevention of dry burningVSAvoidchamber structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The isolation ring segments the first chamber into distinct zones that can be filled with different cooling fluid levels. This segmentation simplifies the manufacturing process by allowing each zone to be filled independently to its optimal level, rather than requiring complex global control mechanisms for the entire chamber.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The primary hot zone is filled with a higher cooling fluid filling rate (excessive action) compared to the secondary hot zone, ensuring that the most critical area for heat dissipation has sufficient fluid to prevent dry burning under maximum heat loads, while other areas use only the necessary amount of fluid.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively manages heat dissipation, preventing functional degradation and maintaining performance by optimizing heat transfer through varied cooling fluid properties and pipe configurations, even under varying power loads.

Implementation Method 1

The working fluid absorbs heat in the evaporation zone and vaporizes

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 2

The heat from the vaporized working fluid is released in the condensation zone and condensed back into a liquid state

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

The liquid working fluid then returns to the evaporation zone through the capillary structure

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

a heat-conducting chamber body having a heat-absorbing surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4600597A1High heat cooling device
Publication Date: 2025.08.13 PURPLE CLOUD DEV PTE LTD
  • EP4600597A1 patent drawingFigure 1
  • EP4600597A1 patent drawingFigure 2
  • EP4600597A1 patent drawingFigure 3

AI summary

A high heat cooling device includes a heat-conducting chamber body that has a heat-absorbing surface, a first chamber, and a second chamber. The first chamber is closer to the heat-absorbing surface than the second chamber. At least one isolation ring is disposed in the first chamber of the heat-conducting chamber body, dividing the first chamber into a primary hot zone and a secondary hot zone. The primary hot zone is not in fluid communication with the secondary hot zone, and the primary hot zone is surrounded by the isolation ring and is in communication with the second chamber.