Segmented Heat Dissipating Member for Thin Semiconductor Apparatus
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Solution Overview
Problem
Conventional semiconductor apparatuses face challenges in achieving a compact, thin form with high heat dissipation properties while using the wire bonding method, as the heat dissipating plate interferes with connection members and limits the thickness reduction due to intricate shapes and resin encapsulant filling issues, and the flip chip method is cost- and reliability-inferior.
Innovation Solution
A semiconductor apparatus design featuring a heat dissipating member with notched sections above connection members, allowing the heat dissipating member to be closer to the semiconductor device without interference, and using a compression molding method for encapsulation to ensure effective heat dissipation and mass productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating plate is attached to the semiconductor apparatus, then heat dissipation properties are improved, but the apparatus thickness increases due to interference with connection members
Solution Approach 1:
The heat dissipating plate is segmented into a first plate and a second plate positioned at different heights. The first plate is located above the semiconductor device while the second plate is positioned above the connection members, creating a stepped configuration that avoids interference with the connection members and reduces the required apparatus thickness while maintaining effective heat dissipation surface area
Solution Approach 2:
The invention transitions from a single-plane heat dissipating plate to a multi-level three-dimensional structure. By positioning heat dissipating surfaces at different vertical heights, the design accommodates the connection members in the lower region while maintaining heat dissipation functionality in the upper region, effectively resolving the thickness conflict
2Temperature
If the heat dissipating plate is positioned closer to the semiconductor device, then heat dissipation efficiency improves, but the connection members cannot be properly accommodated
Solution Approach 1:
The heat dissipating plate is divided into multiple segments at different vertical levels. The first plate segment is positioned close to the semiconductor device for efficient heat transfer, while the second plate segment is positioned higher to accommodate connection members, eliminating the need for complex recessed shapes
Solution Approach 2:
Instead of creating recesses in the heat dissipating plate to accommodate connection members (the conventional approach), the invention inverts the approach by positioning the connection members in the spaces between the stepped plate segments, simplifying both the plate structure and the overall assembly
3Length of stationary object
If a recess is formed in the heat dissipating plate to accommodate connection members, then the apparatus can be made thinner, but residual thickness remains and heat dissipation properties diminish
Solution Approach 1:
Rather than forming a single recessed cavity, the heat dissipating plate is segmented into multiple flat surfaces at different heights. This stepped configuration eliminates deep recesses while maintaining thin profile, and the multiple exposed surfaces provide adequate heat dissipation area without compromising thermal performance
4Productivity
If the flip chip method is used to attach the heat dissipating plate, then mass productivity improves, but reliability and cost performance deteriorate
Solution Approach 1:
The invention merges the heat dissipating plate attachment with the semiconductor device mounting process. The plate is positioned and fixed simultaneously with the semiconductor device on the substrate, eliminating the need for separate flip chip operations while maintaining reliable electrical and thermal connections through the integrated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thinner, more reliable semiconductor apparatus with improved heat conductivity and increased mass productivity by allowing the heat dissipating member to be closer to the semiconductor device without interfering with connection members, while ensuring effective heat dissipation and reducing warpage.
Implementation Method 1
a heat dissipating member disposed on the encapsulant... improved heat conductivity... improved heat dissipation properties
Data Source
AI summary
A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space.