Segmented Heat Dissipation Module for Circuit Boards
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Solution Overview
Problem
Conventional heat dissipation modules using whole copper plates are heavy, costly, and interfere with the operating temperatures of heat-generating elements on a circuit board due to high thermal conductivity, causing heat transfer between elements with different generation rates.
Innovation Solution
A heat dissipation module with a high thermal conductivity copper plate connected to a heat-generating element with high heat generation and a low thermal conductivity aluminum plate connected to a heat-generating element with lower heat generation, using a heat pipe and cooling device to prevent heat interference, and thermal greases for enhanced conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a whole copper plate is used as the heat-transferring plate, then thermal conduction efficiency is improved, but weight and material cost increase
Solution Approach 1:
The heat-transferring plate is divided into multiple sections with different materials (copper and aluminum) rather than using a single whole copper plate. Each section serves a specific heat dissipation zone, allowing the system to achieve efficient heat conduction where needed while reducing overall weight and cost through the use of lighter aluminum in other areas.
Solution Approach 2:
Different regions of the heat-transferring plate are assigned different material properties - copper with high thermal conductivity is used in areas requiring superior heat conduction, while aluminum with lower density is used in areas where weight reduction is prioritized. This local differentiation resolves the contradiction between thermal efficiency and weight.
2Reliability
If a whole copper plate is used as the heat-transferring plate, then thermal conduction efficiency is improved, but material cost increases
Solution Approach 1:
The heat-transferring plate is segmented into different material zones, allowing the expensive copper material to be used only where high thermal conduction is critical, while cheaper aluminum is used in other areas. This segmentation maintains necessary thermal performance while significantly reducing overall material cost.
Solution Approach 2:
The plate employs local quality differentiation by assigning copper to high-heat-generation areas requiring superior conduction and aluminum to areas where cost reduction is prioritized. This localized material assignment optimizes the balance between thermal performance and manufacturing cost.
3Reliability
If a whole copper plate with high thermal conductivity is used, then heat transfer efficiency is improved, but heat interference between heat-generating elements occurs
Solution Approach 1:
The heat-transferring plate is segmented into separate heat dissipation zones with different materials positioned between heat-generating elements. This segmentation creates thermal zones that efficiently conduct heat away from each element while preventing heat transfer between adjacent elements, thus eliminating heat interference.
Solution Approach 2:
Different material sections act as thermal intermediaries between heat-generating elements. The strategic placement of materials with different thermal conductivities in specific zones creates thermal barriers that prevent harmful heat interference while maintaining efficient heat dissipation from each element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces overall weight and material cost while preventing heat interference between elements, maintaining optimal operating temperatures by using a copper plate for high heat generation elements and an aluminum plate for lower heat generation elements.
Implementation Method 1
The heat pipe 120 is connected between the first part 112 of the heat-transferring plate 110 and the fin assembly 130
Implementation Method 2
the heat generated by the first chip 210 and the second chip 220 can be transferred to the fin assembly 130 through the heat-transferring plate 110 and the heat pipe 120
Implementation Method 3
The fan 140 cools the fin assembly 130
Implementation Method 4
thermal greases for enhanced conduction
Data Source
AI summary
A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.