Segmented Heat Dissipation Films for Semiconductor Package Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages often experience warpage during processing, leading to reliability issues such as delamination of thermal interface materials and increased thermal resistance due to CTE mismatch, which affects the integrity and efficiency of heat dissipation.
Innovation Solution
Cutting a heat dissipation sheet into multiple heat dissipation films of common sizes and attaching them to the encapsulated semiconductor device enhances adhesion and reduces delamination, improving heat dissipation efficiency by matching the curvature of the package and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large heat dissipation film is attached to the semiconductor package, then the thermal coverage area is maximized, but the film is prone to delamination due to warpage and CTE mismatch
Solution Approach 1:
The patent divides a single large heat dissipation film into multiple smaller heat dissipation films that are attached to different regions of the semiconductor package. This segmentation reduces the stress concentration and delamination risk on each individual film while collectively covering the entire thermal area, thereby resolving the contradiction between maximizing thermal coverage and maintaining adhesion stability.
2Stability of the object's composition
If the substrate and package are rigidly constrained to prevent warpage, then dimensional stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the physical parameters of the heat dissipation films by making them smaller in size and distributing them across multiple locations. This parameter change allows the films to better accommodate warpage without requiring rigid constraints on the substrate or package, thereby achieving dimensional stability through the film configuration rather than through complex manufacturing constraints.
3Reliability
If multiple different sized heat dissipation films are used to match package curvature, then adhesion is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the heat dissipation film into multiple standardized smaller films with common dimensions. This segmentation approach improves adhesion quality by reducing the size of each film while maintaining manageable and standardized manufacturing precision requirements, as smaller films are easier to position and attach accurately compared to a single large film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces warpage-related issues, enhances adhesion between heat dissipation films and semiconductor devices, and improves thermal efficiency by preventing delamination, thereby increasing the yield and reliability of semiconductor packages.
Implementation Method 1
a plurality of heat dissipation films 400. The plurality of heat dissipation films are disposed on the encapsulated semiconductor package in a side by side manner and cover an upper surface of the encapsulated semiconductor package
Implementation Method 2
enhances adhesion and reduces delamination, improving heat dissipation efficiency by matching the curvature of the package and substrate
Data Source
AI summary
A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.