Segmented Heat Dissipation Frames for Imaging Device Thermal Management
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Solution Overview
Problem
High-resolution digital cameras face significant heat generation due to increased data processing demands, leading to inefficient heat dissipation and potential malfunctions.
Innovation Solution
The electronic device incorporates a heat dissipation structure with three independently provided heat dissipation frames (front, top, and rear) mechanically fixed to their respective cases, creating multiple heat dissipation paths that efficiently transmit heat from internal components to external metal cases for effective dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat dissipation plate is attached to the imaging element, then heat dissipation is provided, but heat transmission efficiency is insufficient and heat equalization is poor
Solution Approach 1:
The heat dissipation structure is divided into three independent heat dissipation frames (first, second, and third) that are separately attached to different cases (top, front, and rear). This segmentation allows heat to be transmitted through multiple independent paths, improving both heat transmission efficiency and heat equalization across the device.
Solution Approach 2:
Multiple heat dissipation frames are combined with respective cases through mechanical fixation to form integrated heat dissipation assemblies. The heat dissipation frames are positioned to contact electronic parts, creating a merged structure that efficiently transmits heat from internal components to external cases through multiple contact points.
2Measurement precision
If high-resolution imaging is implemented, then image quality is improved, but heat generation increases
Solution Approach 1:
The heat dissipation function is segmented into three independent frames that contact different electronic parts and attach to different cases. This creates multiple heat transmission paths that efficiently conduct heat away from high-resolution imaging components, allowing high image quality to be maintained without excessive heat accumulation.
3Temperature
If multiple heat dissipation frames are provided independently, then heat transmission efficiency is improved, but device complexity increases
Solution Approach 1:
Each heat dissipation frame is mechanically fixed to its corresponding case to form an integrated assembly. This merging reduces the number of separate components and simplifies assembly, while still maintaining the benefits of multiple independent heat dissipation paths for efficient heat transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform heat dissipation and equalization, reducing the risk of malfunctions caused by excessive heat generation, thereby enhancing the operational reliability of high-resolution digital cameras.
Implementation Method 1
a heat dissipation frame that transmits heat generated from the electronic part to the external case
Data Source
AI summary
An electronic device includes: an electronic part; an external case that covers the electronic part and constitutes an exterior; and a heat dissipation frame that transmits heat generated from the electronic part to the external case. The external case includes a top case, a front case, and a rear case, while the heat dissipation frame includes a first heat dissipation frame, a second heat dissipation frame, and a third heat dissipation frame provided independently from each other. Mechanical fixation is made to combine the top case and the first heat dissipation frame into one body, to combine the front case and the second heat dissipation frame into one body, and to combine the rear case and the third heat dissipation frame into one body.