Segmented Heat Dissipation Layer for Display Device Thermal Management

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Solution Overview

Problem

As display devices increase in size and brightness requirements, they generate more heat, necessitating effective heat dissipation solutions to prevent overheating and maintain performance.

Innovation Solution

A display device design incorporating a heat dissipation layer on the non-display side with insulated regions for the driving circuit and peripheral areas, combined with a chip-on-film structure that is strategically positioned to manage heat dissipation, using materials like copper or silver alloys for efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the heat dissipation layer is made continuous across the driving circuit arranging region and peripheral region, then heat dissipation efficiency is improved, but electrical short circuit risk increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical short circuit risk

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The heat dissipation layer is segmented into isolated regions: a first heat dissipation region above the driving circuit and a second heat dissipation region in the peripheral area. These regions are electrically isolated to prevent short circuits while maintaining heat dissipation functionality through separate thermal pathways.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the heat dissipation layer are designed with different electrical properties. The first heat dissipation region is isolated from the second heat dissipation region, allowing each region to have optimized electrical characteristics suitable for its specific function while maintaining thermal dissipation capabilities.

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If the driving current is increased to meet display brightness requirements, then display brightness is improved, but heat generation increases

Engineering Contradiction:

Improvedisplay brightnessVSAvoidheat generation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The heat dissipation layer is divided into multiple isolated heat dissipation regions that can independently dissipate heat from different heat-generating components. This segmentation allows for targeted heat management in high-current driving circuit areas without affecting other regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation layer acts as an intermediary thermal management structure between the driving circuit and the display panel. It provides a dedicated thermal pathway that separates heat dissipation from electrical signal transmission, allowing high current operation while maintaining thermal control.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the heat dissipation layer is isolated in the driving circuit arranging region, then electrical reliability is improved, but heat dissipation coverage is reduced

Engineering Contradiction:

Improveelectrical insulationVSAvoidheat dissipation coverage

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The heat dissipation layer is segmented into multiple isolated regions that collectively cover the entire heat-generating area. While each region is electrically isolated, the combination of regions provides comprehensive heat dissipation coverage through distributed thermal pathways.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The solution moves from a two-dimensional continuous heat dissipation layer to a multi-regional distributed structure. By utilizing the vertical dimension and creating multiple isolated layers or regions at different positions, the patent achieves both electrical isolation and comprehensive thermal coverage.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively dissipates heat, preventing overheating and improving the reliability of the display device by isolating potential electrical shorts and enhancing the durability of the heat dissipation film.

Implementation Method 1

a heat dissipation layer, on a non-display side of the display panel... effectively dissipates heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipation layer located in at least a part of the driving circuit arranging region is insulated from the heat dissipation layer located in the peripheral region; isolating potential electrical shorts

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS11538800B2Display device having a heat dissipation layer with a gap separation portion and manufacturing method thereof

Publication Date: 2022.12.27 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

A display device and a manufacturing method thereof are provided. The display device includes a display panel, a heat dissipation layer, and a chip on film. The heat dissipation layer is on a non-display side of the display panel and includes a driving circuit arranging region and a peripheral region. The heat dissipation layer located in at least a part of the driving circuit arranging region is insulated from the heat dissipation layer located in the peripheral region. The chip on film is on a side of the heat dissipation layer away from the display panel and is in the driving circuit arranging region.