Segmented Heat Dissipation for Electronic Modules
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Solution Overview
Problem
Conventional heat dissipation systems for electronic modules often lead to uneven heat distribution, causing hotter components to overheat and degrade the performance and reliability of cooler components, particularly in fully-buffered dual-inline memory modules (FBDIMM) designs.
Innovation Solution
A heat dissipation system comprising multiple thermally conductive segments strategically mounted on both sides of an electronic module to efficiently transfer heat from hotter components to cooler areas, maintaining a uniform temperature profile while ensuring the system's thickness fits within conventional computer systems' space constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation systems are used, then heat is dissipated from electronic modules, but uneven heat distribution causes hotter components to overheat and cooler components to overcool
Solution Approach 1:
The heat dissipation system is divided into multiple independent heat dissipation elements (first heat dissipation element, second heat dissipation element, third heat dissipation element) that can be selectively positioned. Each element targets specific components or regions, allowing differentiated heat management for different components on the module, thereby achieving more uniform temperature distribution across the module.
Solution Approach 2:
Different heat dissipation elements are applied to different locations and components based on their specific thermal requirements. The system provides localized heat dissipation rather than uniform coverage, matching the thermal characteristics of individual components (e.g., memory devices vs. buffer devices) to maintain optimal operating temperatures for each.
2Temperature
If heat dissipation systems are added to electronic modules, then heat removal is improved, but the system thickness increases beyond space constraints of conventional computer systems
Solution Approach 1:
The heat dissipation elements are designed to nest within the existing module structure. The elements can be positioned between components and the module housing, utilizing available space efficiently. This nested arrangement provides effective heat dissipation without significantly increasing the overall thickness of the module assembly.
Solution Approach 2:
Instead of adding thickness in the vertical dimension, the heat dissipation elements are arranged in the horizontal plane across the module surface. Multiple elements are distributed across different areas of the module, providing three-dimensional heat management coverage while maintaining a thin profile in the thickness direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves significant temperature uniformity across components, reducing temperature differences to less than 50°C, thereby improving performance and reliability while preventing cooler components from overheating.
Implementation Method 1
The system further comprises a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment
Data Source
AI summary
A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.