Segmented Heat Dissipation Structure for Electronic Devices
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Solution Overview
Problem
Conventional heat dissipation structures, such as vapor chambers and heat pipes, face challenges in manufacturing complexity and cost due to their structural design, which affects their thermal conductivity and efficiency, especially in elongated forms.
Innovation Solution
A heat dissipation structure comprising a first and second plate body with thermally conductive members disposed between them, arranged along both length and width directions, enhancing continuous heat conduction and structural strength without the need for elongated heat pipes, thus reducing manufacturing costs and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes are used for heat dissipation, then thermal conductivity is improved, but the contact area with heat generating source is limited and manufacturing cost increases for longer heat pipes
Solution Approach 1:
The heat dissipation system is divided into multiple heat pipes of standard lengths, arranged in parallel between the heat generating source and heat dissipation source. This segmentation allows each heat pipe to maintain optimal thermal conductivity while avoiding the need for expensive custom-length heat pipes. The multiple segments work together to provide sufficient heat dissipation capacity without requiring individual elongated heat pipes.
2Area of stationary object
If elongated heat pipes are used to increase contact area, then heat dissipation coverage is improved, but thermal conductivity decreases rapidly and manufacturing cost increases
Solution Approach 1:
Instead of using a single elongated heat pipe that would suffer from rapid thermal conductivity degradation, the system uses multiple standard-length heat pipes arranged in parallel. Each segment maintains high thermal conductivity, and the collective contact area of all segments provides sufficient heat dissipation coverage without requiring any single pipe to be excessively long.
Solution Approach 2:
The solution transitions from a one-dimensional elongated heat pipe approach to a two-dimensional parallel arrangement of multiple heat pipes. This dimensional change allows the system to achieve both sufficient contact area and maintained thermal conductivity by distributing heat dissipation across multiple parallel pathways rather than extending a single pipe.
3Temperature
If vapor chambers are used for heat dissipation, then two-dimensional thermal conductivity is improved, but structural complexity and manufacturing process complexity increase
Solution Approach 1:
The vapor chamber is segmented into multiple discrete heat pipes that can be independently manufactured and assembled. This segmentation simplifies the manufacturing process by allowing standard heat pipe production techniques to be used, avoiding the complex sealed chamber construction required for vapor chambers, while still achieving effective heat distribution through the parallel arrangement.
Solution Approach 2:
The multiple heat pipes serve dual functions: they provide thermal conduction from the heat generating source and simultaneously distribute heat across the heat dissipation source. This multi-functionality replaces the need for a vapor chamber's complex phase-change mechanism while achieving similar heat distribution effects through simpler, more manufacturable components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively enhances heat dissipation by continuous conduction and structural strength, reducing the need for costly elongated heat pipes and addressing issues of poor thermal conductivity, while maintaining cost-effectiveness.
Implementation Method 1
m thermally conductive members (3) are disposed between the first plate body (1) and the second plate body (2)... heat can be continuously conducted
Data Source
AI summary
A heat dissipation structure and an electronic device are provided. The heat dissipation structure includes a first plate body, a second plate body, and m thermally conductive members. The m thermally conductive members are arranged between the first plate body and the second plate body. Among the m thermally conductive members, n thermally conductive members are arranged along at least one of a length direction of the first plate body and a length direction of the second plate body, or a width direction of the first plate body and a length direction of the second plate body, and m≥n≥2.