Segmented Heat Pipes for Portable Device Thermal Management

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Solution Overview

Problem

Portable electronic devices face challenges in effectively dissipating heat generated by dense arithmetic elements and integrated circuits, leading to increased temperature and reduced durability, due to limitations in heat pipe size and heat transportation capability.

Innovation Solution

A heat spreading module comprising a metal plate with a groove housing first and second heat pipes, where the first heat pipe is shorter and thicker, and the second heat pipe is longer and thinner, working together to dissipate heat over a wide range of the metal plate without causing dry-out, by transferring heat from the heating region to a distant area and then to the entire metal plate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a fine heat pipe with size equal to or less than 0.5 mm is used to transport heat, then the heat pipe can be integrated into portable electronic devices with limited space, but the heat transportation capability is limited and cannot transport heat to the entire metal plate

Engineering Contradiction:
Improveheat pipe sizeVSAvoidheat transportation capability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The heat pipe system is segmented into multiple independent heat pipes (first heat pipe and second heat pipe) with different lengths. The first heat pipe has length equal to or less than 0.5 mm for integration into limited space, while the second heat pipe extends longer to transport heat to distant regions. This segmentation allows each heat pipe to perform its function effectively without requiring a single oversized heat pipe.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the metal plate are served by heat pipes with different characteristics. The first heat pipe (shorter, ≤0.5 mm) is positioned to handle heat transport in regions where space is constrained, while the second heat pipe (longer) is positioned to extend heat transport to distant cold regions. Each heat pipe is optimized for its specific location and function.

Inventive Principle:
Principle #3Local quality

2Device complexity

If heat is transported only by thermal conductivity of the metal plate over a great distance, then the structure remains simple, but it is difficult to widely dissipate heat and lower the temperature of heat spots

Engineering Contradiction:
Improveheat dissipation structureVSAvoidheat spot temperature
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The second heat pipe acts as an intermediary heat transport component between the metal plate and distant cold regions. Instead of relying solely on thermal conductivity through the metal plate, the second heat pipe provides a dedicated heat transport pathway that efficiently carries heat over long distances to regions where heat can be dissipated, thereby reducing heat spot temperatures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If the second heat pipe is made longer to reach distant regions, then heat can be transported to a wider area, but the heat pipe becomes more prone to dry-out

Engineering Contradiction:
Improveheat dissipation areaVSAvoidheat pipe dry-out resistance
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The heat transport function is segmented between two heat pipes with different lengths. The first heat pipe (shorter, ≤0.5 mm) handles heat transport over short distances with low dry-out risk, while the second heat pipe (longer) extends the heat dissipation area by transporting heat to distant regions. This segmentation allows the system to achieve wide heat dissipation without requiring a single excessively long heat pipe that would be prone to dry-out.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module effectively suppresses temperature increases in heat generation bodies by efficiently transporting heat across the metal plate, preventing dry-out and ensuring stable heat dissipation, even with high heat generation, thus enhancing the durability and performance of portable electronic devices.

Implementation Method 1

a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe. The second end portion of the first heat pipe is arranged so as to approach a middle portion of the second heat pipe

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Data Source

PatentUS10605538B2Heat spreading module for portable electronic device
Publication Date: 2020.03.31 FUJIKURA LTD
  • US10605538B2 patent drawing
  • US10605538B2 patent drawing
  • US10605538B2 patent drawing

AI summary

A heat spreading module for a portable electronic device includes a metal plate to which a heat generation body contacts, a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate, comprises a first end portion and a second end portion, has a predetermined length, and a portion of the first end portion is arranged in the heating region, and a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe.