Segmented Heat Sink for Bare Die MCP Packages

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Solution Overview

Problem

Bare die processor packages face challenges with heat dissipation due to the removal of the metal lid, which increases thermal resistance and exposes the fragile chips to environmental contamination and pressure loads from heat sinks.

Innovation Solution

A heat sink design that balances the load on the MCP package using brackets and plates to secure the heat sink while distributing pressure evenly, preventing damage and contamination, and allowing for easy handling and removal as a single unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the metal lid is removed from the processor package, then cooling efficiency is improved by reducing thermal resistance, but the bare die becomes exposed to environmental contamination and pressure loads from heat sinks

Engineering Contradiction:

Improvethermal resistanceVSAvoidenvironmental contamination and pressure damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat sink is divided into multiple separate heat sink elements, each coupled to individual processors or groups of processors. This segmentation allows each heat sink element to be independently sized and positioned, distributing pressure loads more evenly across the bare die surfaces while maintaining effective thermal coupling with each processor

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Compliant mounting structures and thermal interface materials are introduced as intermediaries between the heat sink elements and the bare die processors. These intermediaries absorb and distribute pressure loads, preventing direct mechanical stress concentration on the fragile bare die while maintaining thermal contact

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If multiple chips of varying heights are cooled by a single heat sink, then cooling coverage is improved, but pressure distribution becomes unbalanced increasing the risk of damage or cracking

Engineering Contradiction:

Improvecooling coverage areaVSAvoidpressure distribution uniformity

Core Design Contradiction:

Area of stationary objectVSStress or pressure

Solution Approach 1:

The heat sink is segmented into multiple independent heat sink elements rather than using a single large heat sink. Each element can be independently mounted at appropriate heights and pressures, allowing customization for processors of varying heights while maintaining balanced pressure distribution across all chips

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heat sink element is designed with local characteristics tailored to the specific processors it cools, including varying sizes, shapes, and mounting pressures. This local customization ensures optimal thermal coupling and pressure distribution for each processor location, accommodating height variations across the MCP package

Inventive Principle:

Principle #3Local quality

3Temperature

If the heat sink is secured directly to the bare die package, then thermal coupling is improved, but the fragile chips are subjected to concentrated pressure loads increasing damage risk

Engineering Contradiction:

Improvethermal coupling efficiencyVSAvoidchip mechanical strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

Compliant mounting structures and thermal interface materials serve as intermediaries between the heat sink elements and bare die processors. These intermediaries provide mechanical compliance that distributes pressure loads over a larger area while maintaining adequate thermal coupling, protecting the fragile bare die from concentrated stress

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively improves heat dissipation by reducing thermal resistance and ensures the safety of bare die processors by distributing pressure evenly and preventing environmental contamination.

Implementation Method 1

Some or all of this waste heat must be removed from such processors to maintain continuous operation of the computer system

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250138602A1Heat sinks for bare die multi-chip packages

Publication Date: 2025.05.01 AMAZON TECH INC

AI summary

Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.