Segmented Heat Sink Structure for Uneven Chip Heights
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Solution Overview
Problem
Existing heat dissipation methods for integrated circuit chips on circuit boards face issues of poor contact and potential chip damage due to uneven pressure from a single heat sink, especially when chips have varying heights.
Innovation Solution
A heat sink design with a base plate and fins, where each chip is individually attached to a separate heat sink, ensuring full contact and avoiding excessive pressure, using materials like aluminum, copper, or nickel for improved thermal conductivity and corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single heat sink is integrally mounted on the circuit board to contact all integrated circuit chips, then the heat dissipation coverage is improved, but poor contact between the heat sink and some chips causes overheating and malfunction
Solution Approach 1:
The heat sink is divided into multiple independent heat dissipation units, each corresponding to a specific integrated circuit chip. This segmentation allows each unit to be independently adjusted and optimized for its target chip, ensuring reliable thermal contact without compromising overall heat dissipation coverage.
2Area of stationary object
If a single heat sink is mounted to contact all chips, then heat dissipation coverage is improved, but excessive mechanical pressure damages thicker chips
Solution Approach 1:
By segmenting the heat sink into multiple independent units, each unit applies mechanical pressure only to its corresponding chip. This eliminates the cumulative excessive pressure problem that occurs when a single large heat sink contacts multiple chips of varying thicknesses, thereby protecting chip structural integrity.
Solution Approach 2:
Each heat dissipation unit can be independently designed and adjusted to match the specific thickness and thermal requirements of its target chip. This local optimization ensures appropriate pressure distribution and prevents damage to thicker chips while maintaining effective thermal contact.
3Reliability
If separate heat sinks are used for each integrated circuit chip, then contact quality and chip protection are improved, but the device complexity increases
Solution Approach 1:
The heat sink is segmented into multiple independent heat dissipation units that can be separately manufactured and then assembled on the circuit board. This modular approach improves contact quality for each chip while managing complexity through standardized modular components rather than a single complex integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficacy by ensuring full chip contact and prevents chip damage, improving thermal management for integrated circuit chips on circuit boards.
Implementation Method 1
A commonly used heat dissipation method is to integrally mount a heat sink on a circuit board, so that the heat sink is in contact with all the integrated circuit chips on the circuit board to cool them down
Implementation Method 2
The heat sink includes a base plate and a plurality of fins connected to the base plate
Data Source
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AI summary
A heat sink (4) for an integrated circuit chip. The heat sink (4) comprises a base plate (1) and a plurality of fins (2) connected to the base plate (1). The base plate (1) comprises a first segment (11), a second segment (12), and a third segment (13) that are sequentially connected; and the first segment (11) and the third segment (13) extend obliquely upward relative to the second segment (12).