Segmented Heat Sink Plate for Display Device Weight Reduction
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Solution Overview
Problem
The existing display devices with heat sink plates face increased weight and manufacturing costs due to the large area required for effective heat dissipation.
Innovation Solution
A display device design featuring a split heat sink plate that covers only the pressed portions of the frame, minimizing its area while ensuring effective heat transfer to the substrate and frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large area heat sink plate is used to effectively dissipate heat from LED substrates, then heat dissipation performance is improved, but weight and manufacturing cost increase
Solution Approach 1:
The heat sink plate is divided into multiple separate heat sink pieces that are positioned at different locations. Each heat sink piece contacts a corresponding LED substrate to dissipate heat locally, eliminating the need for a single large-area heat sink plate while maintaining effective heat dissipation across all LED substrates.
Solution Approach 2:
The invention extracts the heat dissipation function from a unified large heat sink plate and distributes it to multiple smaller heat sink pieces. Each piece is extracted and positioned independently to contact specific LED substrates, reducing the total material required while preserving the heat dissipation capability.
2Temperature
If a large area heat sink plate is used to cover the entire LED substrate area, then heat transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The heat sink plate is segmented into multiple smaller heat sink pieces, each manufactured independently and then assembled in specific positions. This segmentation reduces manufacturing complexity and material costs while maintaining effective heat transfer from all LED substrates through the distributed heat sink pieces.
Solution Approach 2:
Each heat sink piece is positioned to contact a specific LED substrate location, providing localized heat dissipation where needed. This local quality approach ensures efficient heat transfer at each contact point without requiring a continuous large-area heat sink plate, thereby reducing manufacturing cost.
3Weight of stationary object
If the heat sink plate area is reduced to minimize weight, then weight is decreased, but heat dissipation coverage may be insufficient
Solution Approach 1:
The heat sink function is segmented into multiple pieces distributed across different locations. Each piece covers a specific LED substrate area, and collectively they provide comprehensive heat dissipation coverage equivalent to or better than a single large plate, while using less total material and reducing weight.
Solution Approach 2:
The heat dissipation approach transitions from a two-dimensional large-area plate to a three-dimensional distributed arrangement of multiple pieces at different positions and heights. This dimensional change allows each piece to be optimized for its specific location while collectively achieving comprehensive coverage with reduced total material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the weight and manufacturing costs of the display device while maintaining effective heat dissipation and image quality.
Implementation Method 1
the heat of the LED substrates may be transferred to the heat sink plate
Data Source
AI summary
Disclosed is a display device. The display device of the present disclosure may include: a display panel; a frame which has a pressed portion, and is located in a rear of the display panel; a heat sink plate located between the display panel and the frame; a substrate located between the display panel and the heat sink plate; and a plurality of light sources located on the substrate, wherein a front surface of the frame facing the display panel may include: a first area where the pressed portion is formed; and a second area excluding the first area, wherein the heat sink plate may have an area smaller than an area of the front surface of the frame, and covers the first area, wherein the substrate may be located on the heat sink plate and the second area.