Segmented Heat Sink and Insulation Layout for Semiconductor Packages
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Solution Overview
Problem
Semiconductor devices experience breakage and separation of insulating sheets due to thermal shrinkage during cooling, leading to increased deformation and potential failure.
Innovation Solution
A semiconductor device design where the insulating sheet and heat sink are divided into multiple portions, with all semiconductor elements arranged to overlap these sections, reducing thermal stress and maintaining high heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor device size is increased to improve heat dissipation capacity, then the heat dissipation performance is improved, but the thermal shrinkage deformation increases causing insulating sheet breakage and separation
Solution Approach 1:
The insulating sheet is divided into multiple separate insulating sheets corresponding to different thick portions of the lead frame. This segmentation allows each insulating sheet to independently accommodate thermal shrinkage deformation without causing breakage or separation, while still providing effective thermal insulation across the entire heat dissipation surface.
2Reliability
If the insulating sheet is made thicker to improve insulation performance, then the insulation capability is improved, but the thermal shrinkage stress increases causing breakage and separation
Solution Approach 1:
Rather than using a single thick insulating sheet that would experience high thermal shrinkage stress, the solution segments the insulation function into multiple thinner insulating sheets placed at different locations. Each sheet experiences reduced stress independently, preventing breakage while collectively providing sufficient insulation performance.
3Ease of manufacture
If separate insulating sheets are used for each thick portion, then the fit to lead frame geometry is improved, but the manufacturing complexity and assembly difficulty increase
Solution Approach 1:
Multiple insulating sheets are bonded together using the same adhesive layer and bonding process, merging the assembly steps. The insulating sheets are positioned on different thick portions of the lead frame but are integrated through a unified bonding procedure, reducing overall manufacturing complexity while maintaining good geometric fit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents breakage and separation of the insulating sheet, ensures reliable thermal management, and maintains productivity and cost efficiency by distributing stress and optimizing the arrangement of components.
Implementation Method 1
In the manufacture of a semiconductor device, components of the semiconductor device thermally shrink in the course of reducing the temperature to room temperature after sealing of the semiconductor device with a molding resin
Implementation Method 2
a heat sink disposed below the plurality of lead frames
Data Source
AI summary
A semiconductor device includes: a plurality of lead frames; a plurality of semiconductor elements mounted to the plurality of lead frames; a heat sink disposed below the plurality of lead frames; and an insulating sheet interposed between the plurality of lead frames and the heat sink. The insulating sheet and the heat sink are each divided into two or more portions, and all the plurality of semiconductor elements are arranged at positions overlapping the insulating sheet and the heat sink in plan view.