Segmented Heat Sink for Multi-Element Light Source Cooling
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Solution Overview
Problem
Existing light source devices with multiple light emitting elements face challenges in efficiently cooling these elements due to variations in heat generation rates, leading to potential temperature imbalances and reduced light emission efficiency.
Innovation Solution
A light source device with a heat sink that includes separate heat dissipation portions for each light emitting element, allowing for tailored thermal resistance calculations and efficient heat dissipation through fluid flow paths, ensuring optimal temperature management across elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple light emitting elements are thermally connected to the same heat dissipation portion, then the device complexity is reduced, but temperature uniformity and cooling efficiency deteriorate due to variations in heat generation rates
Solution Approach 1:
The heat sink is segmented into multiple independent heat dissipation portions, each corresponding to a specific light emitting element. This segmentation allows each portion to be optimized for the heat generation characteristics of its associated element, thereby maintaining temperature uniformity across all elements while avoiding excessive overall complexity through modular design
Solution Approach 2:
Each heat dissipation portion is designed with locally optimized thermal resistance characteristics matched to the heat generation rate of its corresponding light emitting element. High heat generation elements are paired with heat dissipation portions having lower thermal resistance, while low heat generation elements use portions with higher thermal resistance, achieving local thermal optimization
2Temperature
If separate heat dissipation portions are provided for each light emitting element, then temperature uniformity and cooling efficiency are improved, but device complexity increases
Solution Approach 1:
The heat sink is divided into multiple independent heat dissipation portions, each with optimized thermal characteristics for its associated light emitting element. This segmentation enables precise thermal management for each element while maintaining overall system compactness through integrated design
Solution Approach 2:
The thermal resistance parameters of different heat dissipation portions are varied according to the heat generation characteristics of corresponding light emitting elements. By adjusting thermal resistance parameters locally, the system achieves optimal temperature uniformity without requiring complex active control mechanisms
3Ease of manufacture
If a single heat sink cools multiple light emitting elements, then manufacturing cost is reduced, but light emission efficiency deteriorates due to temperature rises
Solution Approach 1:
Each heat dissipation portion is designed with locally optimized thermal resistance matched to the specific heat generation rate of its corresponding light emitting element. This local optimization ensures that each element operates at its optimal temperature for maximum light emission efficiency, while the entire heat sink can still be manufactured as a single integrated component
Solution Approach 2:
The thermal resistance parameters of different heat dissipation portions are customized according to the heat generation characteristics of each light emitting element type. This parameter customization maintains high light emission efficiency across all elements while preserving manufacturing simplicity through monolithic heat sink construction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from both high and low heat generation light emitting elements, maintaining appropriate temperatures and enhancing light emission efficiency while preventing temperature rises in adjacent elements.
Implementation Method 1
a first heat dissipation portion that is disposed on a flow path of a fluid, the first heat dissipation portion being configured to radiate the heat of the first light emitting element and the heat of the second light emitting element to the fluid
Implementation Method 2
the first heat dissipation portion being configured to radiate the heat of the first light emitting element and the heat of the second light emitting element to the fluid
Implementation Method 3
a first heat pipe configured to thermally connect the first light emitting element and the first heat dissipation portion
Data Source
AI summary
A light source device includes: a first light emitting element; a second light emitting element; and a heat sink configured to dissipate heat of the first light emitting element and heat of the second light emitting element. The heat sink includes: a first heat dissipation portion that is disposed on a flow path of a fluid, the first heat dissipation portion being configured to radiate the heat of the first light emitting element and the heat of the second light emitting element to the fluid; and a second heat dissipation portion that is disposed on the flow path, the second heat dissipation portion being configured to radiate the heat of the second light emitting element to the fluid.