Segmented Two-Phase Heat Sink for Localized Overheating

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing heat sinks, particularly those with two-phase fins, fail to address localized overheating at high heat fluxes and lack sufficient reliability due to inadequate sealing performance and integration with high thermal conductivity.

Innovation Solution

A heat sink design featuring a heat dissipation substrate divided into multiple substrate cavity bodies by a partition structure, with independent refrigerant circulation in each cavity body, and connected heat dissipation fins, enhancing sealing performance and allowing for tailored heat dissipation based on heat source requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If two-phase fins with high thermal conductivity are used to enhance heat dissipation efficiency, then heat dissipation capability is improved, but localized overheating occurs at high heat fluxes and reliability deteriorates

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidreliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The substrate cavity is divided into multiple independent substrate cavity bodies by partition structures. Each cavity body contains independent refrigerant working medium and operates as a separate two-phase circulation region. This segmentation prevents dry burning in localized areas by ensuring that if one region experiences high heat flux, other regions can still provide cooling, thereby improving reliability while maintaining overall heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

2Productivity

If two-phase fins are used to replace metal fins, then heat transfer capability is improved, but sealing performance deteriorates and reliability is reduced

Engineering Contradiction:

Improveheat transfer capabilityVSAvoidsealing performance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The partition structure divides the substrate cavity into multiple sealed cavity bodies, each containing independent refrigerant working medium. This segmentation improves sealing performance by creating multiple smaller sealed regions rather than one large cavity, making it easier to ensure proper sealing while maintaining the two-phase heat transfer capability.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If a single integrated substrate cavity is used, then manufacturing is simpler, but localized heat dissipation control and reliability are reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidlocalized heat dissipation control

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The substrate cavity is segmented into multiple cavity bodies using partition structures. While this increases manufacturing complexity slightly, it enables independent control and optimization of each region's heat dissipation performance, allowing tailored heat management based on local heat generation characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each substrate cavity body can be designed with different characteristics to match the local heat generation requirements. The partition structure allows each region to be optimized for its specific thermal load, enabling localized heat dissipation control while maintaining overall system reliability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves reliability and redundancy by preventing dry burning in localized areas, maintaining overall heat dissipation efficiency, and allowing for customized heat management through independent two-phase circulation regions.

Implementation Method 1

a heat dissipation substrate, configured for absorbing heat from a heat source

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

refrigerant working medium in every two adjacent substrate cavity bodies are not in circulation with each other

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

independent two-phase circulation regions

Methodology Applied

Scientific EffectTwo-phase flow: Two-Phase Flow

Implementation Method 4

a plurality of heat dissipation fins, connected to the heat dissipation substrate

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 5

heat dissipation fins

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20250344347A1Heat sink and communication device

Publication Date: 2025.11.06 ZTE CORP

AI summary

A heat sink and a communication device are disclosed. The heat sink may include: a heat dissipation substrate, configured for absorbing heat from a heat source, a substrate cavity and a partition structure are arranged in the heat dissipation substrate, the partition structure is configured for dividing the substrate cavity into a plurality of substrate cavity bodies, and refrigerant working medium in every two adjacent substrate cavity bodies are not in circulation with each other, and a plurality of heat dissipation fins, connected to the heat dissipation substrate.