Segmented Heat Sink Protrusions for Multi-Component Thermal Management
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Solution Overview
Problem
Existing electronic devices, such as liquid discharge devices, face challenges in efficiently dissipating heat generated by circuit elements, which can lead to instability and reduced reliability due to varying sizes and dimensions of heat-generating components.
Innovation Solution
The electronic device incorporates a substrate with a heat sink that includes a base portion covering both electronic components, along with protruding portions for heat conductive members, allowing for targeted heat dissipation from components of different sizes and dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat sink is used for multiple electronic components of different sizes, then the device structure is simplified, but the heat dissipation efficiency for each component cannot be optimized
Solution Approach 1:
The heat sink is segmented into multiple protruding portions, each corresponding to a specific electronic component. Each protruding portion has a customized length adapted to the thickness of the underlying component, enabling individualized heat dissipation paths for each component while maintaining a unified heat sink structure.
Solution Approach 2:
Different regions of the heat sink are designed with different local characteristics through varying the lengths of protruding portions. Each protruding portion's length is locally optimized to match the thickness of the corresponding electronic component, creating tailored thermal contact for each component's heat dissipation needs.
2Ease of manufacture
If the protruding portion length is uniform, then the manufacturing process is simplified, but effective thermal contact with components of different thicknesses cannot be achieved
Solution Approach 1:
The protruding portions are segmented with different lengths corresponding to different component thicknesses. This segmentation allows each portion to be precisely tailored to its underlying component while maintaining a systematic manufacturing approach through modular design.
Solution Approach 2:
The length parameter of the protruding portions is varied to match the thickness parameters of different electronic components. This parameter adjustment enables precise thermal contact for each component type while maintaining overall structural consistency in the heat sink design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, improving the stability and reliability of the electronic device by effectively managing heat from components of varying sizes and dimensions.
Implementation Method 1
a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component
Data Source
AI summary
An electronic device including a substrate, a first electronic component provided on the substrate, a second electronic component provided on the substrate and having a thickness in a normal direction of the substrate smaller than that of the first electronic component, a first heat conductive member in contact with the first electronic component, a second heat conductive member in contact with the second electronic component, and a heat sink attached to the substrate, in which the heat sink includes a base portion provided so as to cover the first electronic component and the second electronic component and attached to the substrate, a first protruding portion that protrudes from the base portion toward the first electronic component and is in contact with the first heat conductive member, and a second protruding portion that protrudes from the base portion toward the second electronic component and is in contact with the second heat conductive member, and a length of the first protruding portion in the normal direction is shorter than a length of the second protruding portion in the normal direction.