Segmented Heat Sink with Slit for Independent Thermal Zones
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Solution Overview
Problem
Conventional heat radiation devices struggle to effectively dissipate heat from closely packed heat-producing components on printed circuit boards, as they often exceed permissible operating temperatures due to thermal influences from adjacent components, and traditional methods like using a single large heat sink are inefficient in managing different temperature margins.
Innovation Solution
A heat radiation device with a heat sink featuring a slit that divides it into two loosely coupled heat radiation regions, allowing independent heat dissipation for components with different temperature margins, and the use of heat conductive rubbers with varying thermal conductivities to optimize heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large heat sink is used to cover multiple heat-producing components, then the heat dissipation area is increased, but the temperature distribution becomes uniform and cannot meet different temperature requirements of components with different permissible operating temperatures
Solution Approach 1:
The heat sink is divided into multiple independent heat dissipation regions by forming heat separation slits. Each region can be independently contacted with heat-producing components having different permissible operating temperatures, allowing differential temperature management while maintaining a single heat sink structure.
Solution Approach 2:
Different regions of the heat sink are designed with different thermal characteristics by creating heat separation slits. Each local region can be optimized for specific temperature requirements of adjacent components, achieving non-uniform temperature distribution across the heat sink surface to match component-specific thermal needs.
2Temperature
If heat separation slits are introduced to create independent heat radiation regions, then temperature control for different components is improved, but device complexity increases
Solution Approach 1:
The heat sink is segmented into independent heat radiation regions through heat separation slits, enabling separate temperature control for different components. This segmentation is achieved by introducing thermal resistance barriers that prevent heat flow between regions, allowing each region to be independently optimized for its adjacent component's temperature requirements.
Solution Approach 2:
Heat separation slits act as thermal intermediary elements between adjacent heat-producing components. These slits introduce controlled thermal resistance that mediates heat flow, preventing excessive heat transfer from high-temperature components to low-temperature components while maintaining physical continuity of the heat sink structure.
3Area of stationary object
If heat-producing components are disposed closely to achieve high-density mounting, then space utilization is improved, but thermal influence from adjacent components causes temperature to exceed permissible operating temperatures
Solution Approach 1:
The heat sink structure is segmented into independent heat radiation regions that can be separately contacted with closely disposed heat-producing components. This segmentation allows each component to have dedicated heat dissipation pathways, preventing thermal interference between adjacent components even when they are closely mounted on the printed circuit board.
Solution Approach 2:
Heat separation slits serve as thermal intermediaries between closely spaced heat-producing components, blocking excessive heat flow from high-power components to temperature-sensitive components. This intermediary structure enables high-density component placement while maintaining each component's operating temperature within permissible limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains component temperatures below their permissible values by reducing thermal equilibrium between regions, allowing for efficient heat dissipation and reducing the number of components and associated costs, while supporting high-density mounting of heat-producing components.
Implementation Method 1
the heat generated by heat-producing components 602a and 602b heats up heat sink 603, which produces the phenomenon of natural convection through a ventilator (not shown) or vent openings 604a and 604b
Implementation Method 2
Heat sink 210 is in contact with first heat-producing component 241 and second heat-producing component 242 on semiconductor 231
Data Source
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AI summary
Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.