Segmented Heat Sink Structure for Distorted Device Surfaces
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Solution Overview
Problem
Conventional heat sink structures face challenges in maintaining effective thermal contact with electronic components due to non-flat surfaces and thermal distortion, leading to reduced heat transfer efficiency.
Innovation Solution
A heat sink structure comprising multiple spaced-apart heat sink parts with adjustable contact areas that can accommodate surface distortions, allowing for flexible positioning and maintaining contact with electronic components, even when their surfaces become curved or deformed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single large contact area is used, then the heat sink structure is simpler, but it cannot adapt to surface distortions of the electronic component
Solution Approach 1:
The heat sink structure is divided into multiple discrete heat sink parts (e.g., pins or fins) that are spaced apart from each other. Each part has its own contact area that can independently adjust to surface distortions, allowing the overall structure to adapt to non-flat component surfaces while maintaining thermal contact effectiveness.
2Adaptability or versatility
If heat sink parts are spaced apart, then adaptability to surface distortion improves, but thermal contact area decreases
Solution Approach 1:
Each heat sink part is designed with specific local characteristics including optimized contact area size, spacing distance, and geometric configuration. The local quality of each part is tailored to maximize thermal contact at its specific location while the collective arrangement maintains overall adaptability to surface variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible heat sink structure enhances thermal contact and heat transfer efficiency by allowing the contact areas to adjust to surface distortions, thereby maintaining effective heat dissipation from electronic components.
Implementation Method 1
A heat sink may consist of a metal structure having elements which serve to lead the heat away from the component
Implementation Method 2
the heat sink structure enhances thermal contact and heat transfer efficiency by allowing the contact areas to adjust to surface distortions, thereby maintaining effective heat dissipation from electronic components
Data Source
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AI summary
A heat sink structure (10) comprises a plurality of heat sink parts (16), each heat sink part having a contact area (12) for contacting a surface of an electronic device. The heat sink parts (16) may be connected but are spaced apart so as to allow them to adjust and keep their contact areas (12) contacting the surface of the electronic device when the surface is distorted, for example due to heating. A heat sink part (16) may comprise at least two spaced apart heat sink elements (11) which may be connected.