Segmented Heat Spreader Layout for IC Thermal Cross-Talk
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit devices with varying power densities and operating temperatures pose challenges for heat dissipation, as a single uniform heat dissipation device struggles to optimize both low one-dimensional heat conduction resistance and heat spreading resistance, leading to thermal cross-talk and potential device damage.
Innovation Solution
A heat dissipation device comprising both anisotropic and isotropic thermally conductive sections, where anisotropic sections provide high conductivity in one direction with low conductivity in others, and isotropic sections facilitate heat spreading, reducing thermal cross-talk and optimizing thermal resistances based on power maps of integrated circuit devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single uniform heat dissipation device is used, then the device structure is simple, but it cannot optimize both low one-dimensional heat conduction resistance and heat spreading resistance simultaneously
Solution Approach 1:
The heat dissipation device is divided into multiple sections with different thermal conductivity characteristics. Specifically, it includes high thermal conductivity sections (for low heat conduction resistance) and low thermal conductivity sections (for heat spreading), allowing each section to perform its specialized function independently
Solution Approach 2:
Different sections of the heat dissipation device are assigned different thermal conductivity properties based on local requirements. High thermal conductivity sections are positioned where rapid heat removal is needed, while low thermal conductivity sections are placed where heat spreading is required to reduce thermal cross-talk
2Reliability
If high thermal conductivity material is used throughout, then heat conduction resistance is low, but thermal cross-talk between devices increases
Solution Approach 1:
The heat dissipation device is segmented into high thermal conductivity sections and low thermal conductivity sections. The low thermal conductivity sections act as thermal barriers that prevent heat from spreading laterally between adjacent integrated circuit devices, thereby reducing thermal cross-talk
Solution Approach 2:
Low thermal conductivity sections are strategically positioned between high power density integrated circuit devices to create thermal isolation zones, while high thermal conductivity sections are used within each device's heat path to efficiently conduct heat away from hot spots
3Object-generated harmful factors
If low thermal conductivity material is used throughout, then thermal cross-talk is reduced, but heat conduction resistance becomes too high
Solution Approach 1:
The device alternates between high thermal conductivity sections (for efficient heat conduction) and low thermal conductivity sections (for thermal isolation). This segmentation ensures that heat is efficiently removed from each integrated circuit device while preventing lateral heat spread to neighboring devices
Solution Approach 2:
High thermal conductivity sections are localized to the heat path regions directly beneath each integrated circuit device to ensure efficient heat removal, while low thermal conductivity sections are positioned in the inter-device regions to provide thermal isolation
4Reliability
If the heat dissipation device is optimized for uniform power distribution, then one-dimensional heat conduction resistance is minimized, but it cannot address non-uniform power densities and hot spots
Solution Approach 1:
The heat dissipation device uses low thermal conductivity sections to create localized heat spreading regions that address hot spots and non-uniform power densities. These sections allow heat to spread laterally in controlled areas before being conducted vertically away, adapting to varying power distribution patterns
Solution Approach 2:
The device structure segments heat management functions into distinct zones: low thermal conductivity sections for heat spreading and lateral heat management, and high thermal conductivity sections for vertical heat conduction. This segmentation allows the device to handle both uniform and non-uniform power distribution scenarios effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat dissipation by minimizing thermal cross-talk and optimizing thermal resistances, preventing device damage and enhancing the reliability of integrated circuit packages.
Implementation Method 1
at least one anisotropic thermally conductive section (uniformly high thermal conductivity in at least one direction (e.g. z-direction) and relatively low thermal conductivity in at least one of other direction (e.g. x-direction and/or y-direction))
Implementation Method 2
at least one anisotropic thermally conductive section
Implementation Method 3
at least one isotropic thermally conductive section (relatively high thermal conductivity in all 3 cartesian directions x, y, and z)
Data Source
AI summary
A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.