Segmented Heat Spreaders with Air Channels for Memory Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As memory device density and processing speed increase, heat generation also rises, potentially exceeding maximum operating temperatures without sufficient cooling, which can impair memory package performance.
Innovation Solution
The use of thermally conductive heat spreaders with air channels to dissipate heat from memory modules, including configurations with multiple air channels and surface-area increasing structures, attached to both sides of adjacent memory modules to enhance airflow and heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory device density and processing speed are increased, then memory performance is improved, but heat generation increases causing operating temperature to exceed maximum limits
Solution Approach 1:
The heat spreader is divided into multiple segments with air channels separating them, allowing heat to be dissipated through multiple pathways rather than a single solid structure. This segmentation enables forced air flow to pass through the heat spreader, enhancing heat removal efficiency while maintaining structural integrity.
Solution Approach 2:
The patent introduces air channels through the heat spreader structure, utilizing forced air flow to remove heat from semiconductor devices. The air channels enable pneumatic cooling by allowing air to pass through the heat spreader, carrying heat away from the devices more effectively than solid conduction alone.
2Temperature
If heat spreader surface area is increased to improve heat dissipation, then temperature reduction is enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat spreader incorporates air channels that extend through the thickness of the structure, adding a vertical dimension to heat dissipation. This allows heat to be removed not only from the top surface but also through the internal channels, effectively increasing the heat exchange surface area without proportionally increasing the external footprint.
Solution Approach 2:
The heat spreader is designed with air channels creating a porous-like structure that allows fluid (air) to pass through. This internal channel network increases the effective surface area for heat transfer while maintaining a compact external form factor, balancing heat dissipation performance with structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the operating temperature of semiconductor devices, as demonstrated by experimental models showing temperature reductions with forced air flow, thereby improving memory system performance and reliability.
Implementation Method 1
A heat spreader can be provided to conduct thermal energy away from the memories
Implementation Method 2
The plurality of air channels can be configured to receive a forced air flow from a fan
Data Source
AI summary
A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices.