Segmented Heat Spreading Substrate for High-Power Semiconductor Thermal Management
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Solution Overview
Problem
Conventional mounting and heat sinking methods for high-power semiconductor devices, such as LEDs and RF devices, are ineffective in managing heat due to the poor thermal conductivity of their substrates, like sapphire or GaAs, leading to inefficient heat removal and potential device overheating.
Innovation Solution
A heat spreading substrate system comprising a conductive layer, an insulating layer, and a thermally conductive layer, where the layers are configured to be co-planar and have a wider surface area than height, allowing for efficient heat dissipation and electrical connectivity, using rolled materials that are compatible with existing integrated circuit design and manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional mounting and heat sinking methods are used with sapphire or GaAs substrates, then the devices can be mounted and connected electrically, but heat removal is inefficient due to poor thermal conductivity of the substrate materials
Solution Approach 1:
The substrate system is segmented into multiple functional layers: an electrical insulating layer (sapphire or GaAs) for electrical isolation, a thermally conductive intermediate layer for heat transfer, and a heat sink structure for heat dissipation. This segmentation allows each layer to optimize its specific function without compromising the others.
Solution Approach 2:
The invention uses a composite substrate structure combining materials with different properties: electrically insulating but thermally conductive materials (such as aluminum nitride, aluminum oxide, or beryllium oxide) are integrated with the sapphire or GaAs layer to create a composite that provides both electrical isolation and effective heat removal.
2Reliability
If the substrate provides electrical insulation for high-power devices, then electrical functionality is maintained, but thermal conductivity is insufficient for effective heat management
Solution Approach 1:
The substrate system is segmented into multiple functional layers: an electrical insulating layer (sapphire or GaAs) for electrical isolation, a thermally conductive intermediate layer for heat transfer, and a heat sink structure for heat dissipation. This segmentation allows each layer to optimize its specific function without compromising the others.
Solution Approach 2:
The invention uses a composite substrate structure combining materials with different properties: electrically insulating but thermally conductive materials (such as aluminum nitride, aluminum oxide, or beryllium oxide) are integrated with the sapphire or GaAs layer to create a composite that provides both electrical isolation and effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat generated by high-power devices, ensuring efficient thermal conductivity and electrical functionality, thereby enhancing the performance and reliability of semiconductor devices while being cost-effective and compatible with existing technologies.
Implementation Method 1
a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer
Implementation Method 2
The faces of the first conductive layer, the first insulating layer and the thermally conductive layer are substantially co-planar; and a sum of widths of faces of the first conductive layer, the first insulating layer and the thermally conductive layer is greater than a height of the faces
Data Source
AI summary
Heat spreading substrate. In an embodiment in accordance with the present invention, an apparatus includes a first conductive layer, a first insulating layer disposed in contact with the first conductive layer and a thermally conductive layer disposed in contact with the first insulating layer, opposite the first conductive layer. The faces of the first conductive layer, the first insulating layer and the thermally conductive layer are substantially co-planar; and a sum of widths of faces of the first conductive layer, the first insulating layer and the thermally conductive layer is greater than a height of the faces. The first conductive layer and the first insulating layer may include rolled materials.