Segmented Heatsink for Uneven Die Heights and Balanced TIM Pressure
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Solution Overview
Problem
Current thermal solutions struggle to effectively manage thermal challenges in devices with multiple heat sources of varying heights, leading to pressure concentrations and reduced thermal performance, particularly in scenarios where high-power dies are close together, as traditional methods like pedestal features and gap pads have limitations and can cause solder joint failure and die crack.
Innovation Solution
A segmented heatsink design with independent segments that can accommodate different heat source heights, allowing for balanced TIM pressure and reduced sensitivity to die height variations, implemented with loading mechanisms like leaf springs and heat pipes to ensure efficient thermal management without relying on monolithic cold plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional monolithic cold plates with pedestal features are used, then thermal management can be provided for multiple heat sources, but pressure concentrations occur leading to solder joint failure and die crack
Solution Approach 1:
The cold plate is divided into multiple independent segments, each capable of independently contacting and applying pressure to individual heat sources. This segmentation eliminates pressure concentrations that would occur with a monolithic structure, as each segment can be independently loaded and positioned to match the specific height and thermal requirements of each heat source, thereby preventing solder joint failure and die crack while maintaining effective thermal management.
2Adaptability or versatility
If pedestal features and gap pads are used to accommodate height variations, then different heat source heights can be managed, but device complexity increases and reliability decreases
Solution Approach 1:
The cold plate is divided into multiple independent segments, each capable of independently contacting and applying pressure to individual heat sources. This segmentation eliminates pressure concentrations that would occur with a monolithic structure, as each segment can be independently loaded and positioned to match the specific height and thermal requirements of each heat source, thereby preventing solder joint failure and die crack while maintaining effective thermal management.
Solution Approach 2:
The cold plate segments are designed with independent loading mechanisms that allow dynamic adjustment of contact pressure and position for each segment. This enables the system to adapt to varying heat source heights and configurations without requiring static pedestal features or gap pads, thereby maintaining reliability while providing versatility.
3Reliability
If segmented heatsink design is implemented, then balanced TIM pressure is achieved across multiple heat sources, but device complexity increases
Solution Approach 1:
The cold plate is divided into multiple independent segments, each capable of independently contacting and applying pressure to individual heat sources. This segmentation eliminates pressure concentrations that would occur with a monolithic structure, as each segment can be independently loaded and positioned to match the specific height and thermal requirements of each heat source, thereby preventing solder joint failure and die crack while maintaining effective thermal management.
Solution Approach 2:
The segmented cold plate design uses standardized segments that can be configured to accommodate multiple heat sources with varying heights and thermal requirements. Each segment serves multiple functions: thermal conduction, pressure distribution, and height accommodation. This multi-functionality reduces the need for additional specialized components, thereby managing complexity while achieving balanced TIM pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The segmented heatsink design enhances thermal performance by maintaining balanced TIM pressure across multiple heat sources, reducing the risk of solder joint failure and die crack, while minimizing the need for additional mounting holes and accommodating various configurations, thus addressing the limitations of existing thermal solutions.
Implementation Method 1
A first heatsink segment is positioned over a first heat source and a second heatsink segment is positioned over a second heat source
Implementation Method 2
A segmented heatsink design with independent segments that can accommodate different heat source heights, allowing for balanced TIM pressure and reduced sensitivity to die height variations
Implementation Method 3
implemented with loading mechanisms like leaf springs and heat pipes to ensure efficient thermal management
Implementation Method 4
implemented with loading mechanisms like leaf springs and heat pipes to ensure efficient thermal management
Data Source
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AI summary
Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.