Segmented High-Side Driver Packaging for Higher Yield Assembly
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Solution Overview
Problem
Conventional driving devices with built-in packages face high costs due to malfunctions and decreased yield rates in packaging, as the entire high-side driving unit must be replaced if any one of the high-side driving circuits malfunctions.
Innovation Solution
The driving device is designed with a lead frame that includes separate high-side and low-side driving regions, allowing each high-side driving module to be packaged individually within a built-in package. This enables pre-inspection and replacement of only the malfunctioned module, reducing costs and improving packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If three high-side driving circuits are packaged together in a built-in package to form a high-side driving unit, then the inspection can be performed in advance, but when any one of them malfunctions the entire unit must be replaced increasing cost and decreasing yield rate
Solution Approach 1:
The patent divides the high-side driving unit into three separate high-side driving modules, each packaged individually in its own built-in package. This segmentation allows each module to be inspected and replaced independently, so that when one module malfunctions, only that specific module needs to be replaced rather than the entire unit. This resolves the contradiction by maintaining inspection capability while improving packaging efficiency and reducing waste.
2Reliability
If three high-side driving circuits are packaged together in a built-in package, then the high-side driving unit can be inspected in advance, but the yield rate of packaging is decreased and packaging time is increased
Solution Approach 1:
By packaging each high-side driving circuit separately in individual built-in packages rather than grouping them together, the patent enables parallel processing during manufacturing. Multiple modules can be packaged and inspected simultaneously, increasing the overall packaging yield rate and reducing total packaging time while maintaining the ability to perform pre-inspection on each module.
Solution Approach 2:
Each high-side driving module is packaged and inspected independently before being assembled into the final power module. This preliminary action on individual modules allows for early detection and replacement of defective modules, preventing waste of subsequent assembly efforts and improving overall packaging yield rate.
3Reliability
If three high-side driving circuits are packaged together in a built-in package, then the high-side driving unit can be inspected in advance, but the packaging time is increased
Solution Approach 1:
The patent segments the packaging process into three independent parallel processes, one for each high-side driving module. While the conventional approach requires sequential packaging of three circuits in one unit (taking time T), the segmented approach allows three separate modules to be packaged simultaneously or in overlapping sequences, reducing the total packaging time to approximately T/3 or less, while each module still receives thorough inspection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the cost associated with malfunctions by allowing for the replacement of only the faulty high-side driving module, while also increasing the yield rate and reducing packaging time by eliminating the need for integral packaging of multiple high-side driving circuits.
Implementation Method 1
The leads of each of the high-side driving modules are welded to the high-side driving regions of the lead frame
Data Source
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AI summary
A driving device (100) includes a plurality of high-side driving modules (20), at least one low-side driving module (30), a plurality of high-side switching modules (40), a plurality of low-side switching modules (50), an outer package (60), and a lead frame (10) having a plurality of high-side driving regions (11), at least one low-side driving region (13), a plurality of high-side switching regions (14), and a plurality of low-side switching regions (15). The high-side driving modules (20) are respectively disposed in the high-side driving regions (11) and respectively include a built-in package (21), a primary-side circuit (22), a drive-side circuit (23), and a bootstrap diode (24) that are packaged in the built-in package (21). The built-in package (21) has a bottom surface (212) with a plurality of leads (213). The leads (213) are electrically connected to the primary-side circuit (22), the drive-side circuit (23), and the bootstrap diode (24).