Segmented Holding Head for Contactless Wafer Stacking Alignment

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Solution Overview

Problem

Existing semiconductor manufacturing processes face challenges in achieving precise and efficient stacking and bonding of semiconductor structures, particularly in wafer-level packaging, which can result in issues like bulges and air gaps, leading to reduced yield and process window.

Innovation Solution

A holding head structure with individually controllable holding units, utilizing electrostatic or magnetic forces to deform and position semiconductor structures in a warped form, allowing for precise alignment and stacking onto a substrate without physical contact, followed by controlled release and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional contact-based holding methods are used, then the semiconductor structure can be held and positioned, but physical contact causes deformation, bulges, and air gaps that reduce manufacturing precision

Engineering Contradiction:

Improveholding stabilityVSAvoidstacking precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the conventional mechanical contact-based holding system with a magnetic field-based holding system. The holding head generates a magnetic field that interacts with a magnetic layer on the semiconductor structure to provide holding force without physical contact, thereby eliminating contact-induced deformation, bulges, and air gaps while maintaining holding stability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a magnetic field as an intermediary between the holding head and the semiconductor structure. The magnetic field serves as the transmission medium for the holding force, allowing the holding head to exert control over the semiconductor structure without direct mechanical contact, thus preventing contact-related defects

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional stacking methods are used, then the process is simple, but alignment precision is poor leading to reduced yield

Engineering Contradiction:

Improveprocess simplicityVSAvoidalignment precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces conventional mechanical alignment and positioning methods with a magnetic field-based positioning system. The magnetic field enables precise control of the semiconductor structure's position and orientation during stacking, achieving high alignment precision while maintaining process simplicity through contactless operation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes changes in magnetic field parameters (strength, distribution, polarity) to achieve precise positioning and alignment of the semiconductor structure. By dynamically adjusting magnetic field parameters, the system can control the semiconductor structure's position with high precision throughout the stacking process

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures optimal stacking and bonding with a larger process window, reducing defects and increasing yield by avoiding bulges and air gaps, and enabling precise alignment and efficient semiconductor structure assembly.

Implementation Method 1

utilizing electrostatic or magnetic forces to deform and position semiconductor structures in a warped form

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

utilizing electrostatic or magnetic forces to deform and position semiconductor structures in a warped form

Methodology Applied

Scientific EffectMagnetic force: Magnetism

Implementation Method 3

The semiconductor structure is held in a non-linear form by the holding head structure through electrostatic reaction

Methodology Applied

Scientific EffectElectrostatic reaction: Electrostatics

Data Source

PatentUS20260011681A1Holding head structure and manufacturing method of semiconductor structure using the same

Publication Date: 2026.01.08 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A holding head structure and a manufacturing method using the same are disclosed. The holding head structure includes a body of a matrix material, a plurality of operating cores embedded in the matrix material of the body, and a plurality of isolators in the body and defining holding units. The holding units are electrically isolated from one another by the plurality of isolators. Each holding unit includes at least one operating core, and each holding unit is configured to be individually controlled and be electrically connected to a power source.