Segmented IC Die Packaging for Yield Enhancement
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Solution Overview
Problem
The high cost of manufacturing multiple integrated circuit (IC) products with varying logic capacities, as existing methods require separate mask sets for each capacity, leading to significant manufacturing expenses.
Innovation Solution
A method involving a single IC die with multiple operational portions, where some portions can be rendered non-operational during packaging, allowing for the creation of multiple product variants from a single die, reducing the need for multiple mask sets and enabling cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate mask sets are used for each IC product capacity, then manufacturing precision and product differentiation are improved, but manufacturing cost increases significantly
Solution Approach 1:
A single mask set is designed to produce IC dies that can be packaged in multiple configurations to serve different product capacities. The mask set creates a universal die structure that can be adapted through selective packaging approaches (full-package, half-package, quarter-package) to meet different customer requirements, eliminating the need for separate mask sets for each product variant.
Solution Approach 2:
The IC die is divided into multiple functional portions that can be selectively activated or deactivated during packaging. By segmenting the die into distinct operational regions, the same physical die can be configured to provide different logic capacities when packaged differently, allowing one mask set to serve multiple product specifications.
2Adaptability or versatility
If multiple mask sets are produced for different logic capacities, then product versatility is improved, but device complexity and manufacturing process complexity increase
Solution Approach 1:
The patent implements a universal die design that can be packaged to create multiple product variants within a family. Instead of managing multiple specialized mask sets, the company uses one versatile mask set that produces dies capable of being configured for different logic capacities through selective packaging, reducing mask set management complexity while maintaining product family variety.
3Ease of manufacture
If a single mask set is used for all products, then manufacturing cost is reduced, but manufacturing precision and product differentiation deteriorate
Solution Approach 1:
The die is segmented into multiple functional portions that can be selectively activated. The single mask set produces a unified die structure that includes all possible functional regions, and product differentiation is achieved during packaging by selectively activating specific segments. This maintains manufacturing simplicity while enabling precise product differentiation.
Solution Approach 2:
The mask set is designed in advance to include all possible functional portions that may be needed for different product variants. Rather than creating different mask sets for different products, the preliminary design incorporates potentiality for multiple configurations, and the actual product differentiation is realized through selective packaging decisions made after manufacturing.
Data Source
AI summary
An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is tested prior to packaging. If a first portion of the IC die is fully functional, but a second portion includes a localized defect, then the IC die is packaged with a product selection code that configures the IC die to operate as only the first portion of the die. The second portion of the die is deliberately rendered non-operational. Therefore, the IC die can still be sold as a fully functional packaged IC.