Segmented Inset Lid for Uniform TIM and Coolant Flow Packaging

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Solution Overview

Problem

Conventional semiconductor packaging technologies face challenges with nonuniformity in thermal interface material (TIM) bond line thickness due to varying component heights and assembly tolerances, leading to increased thermal resistance and warpage, which hinders efficient cooling and solder attachment.

Innovation Solution

A segmented inset lid is introduced, comprising a primary component and one or more secondary components, each with integrated heat transfer features and a compliant adhesive, forming a uniform seal with a removable flow cover for coolant distribution, minimizing TIM thickness and assembly warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional single-piece lid is used, then the sealing function is provided, but nonuniform TIM bond line thickness occurs due to varying component heights and assembly tolerances, leading to increased thermal resistance

Engineering Contradiction:

Improvesealing functionVSAvoidTIM bond line thickness uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The lid is divided into multiple segments (first lid segment, second lid segment, third lid segment) that can independently conform to the varying heights of components beneath them. Each segment is separately positioned and bonded, allowing the TIM bond line thickness to be uniform across each segment despite overall component height variations, thereby resolving the contradiction between providing a seal and maintaining TIM uniformity.

Inventive Principle:

Principle #1Segmentation

2Reliability

If a conventional single-piece lid is used, then the sealing function is provided, but assembly warpage occurs due to varying component heights and tolerances

Engineering Contradiction:

Improvesealing functionVSAvoidassembly warpage

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

3Temperature

If integrated heat transfer features are added to the lid, then heat transfer efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidlid structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The lid segments integrate heat transfer features (such as heat sinks or thermal pathways) directly into their structures, combining the sealing function and heat dissipation function into a single component. This merging eliminates the need for separate heat sinking components, thereby improving heat transfer efficiency while actually reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The segmented lid design reduces thermal resistance and assembly warpage, allowing for efficient coolant distribution and reduced package weight, while maintaining reliability and compatibility with standard assembly processes.

Implementation Method 1

a compliant adhesive between the primary component and the one or more secondary components

Methodology Applied

Scientific EffectCompliant adhesive: Adhesive

Implementation Method 2

facilitate fluid flow over the primary and secondary components when a pressure gradient is applied

Methodology Applied

Scientific EffectForced convection: Forced Convection

Implementation Method 3

integrated extended surfaces to promote heat transfer

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 4

facilitate fluid flow over the primary and secondary components when a pressure gradient is applied

Methodology Applied

Scientific EffectPressure gradient: Pressure Gradient

Data Source

PatentUS12512390B2Semiconductor package with liquid flow-over segmented inset lid

Publication Date: 2025.12.30 LOCKHEED MARTIN CORP

AI summary

A semiconductor package is provided. The semiconductor package includes a segmented inset lid that is divided into a primary component and one or more secondary components, with each secondary component being coupled to the primary component by a compliant liquid-tight adhesive; wherein the primary component is a continuous region including i) a first surface, ii) a second surface, and iii) a boundary surface, the first surface including one or more integrated heat sink surfaces or one or more routing features to promote coolant distribution, the second surface contacting one or more semiconductor dies, and the boundary surface forming a sealing surface with a semiconductor substrate; wherein each secondary component contacts at least one other semiconductor die and forms a water-tight seal with the primary component; and a removable flow cover coupled with the segmented inset lid to form a seal along the boundary surface.