Segmented LAB Row Repair Using Multiplexer Remapping

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Solution Overview

Problem

Integrated circuit devices with programmable logic fabric face unreliability and unusability when multiple rows of logic array blocks fail, as existing repair methods involving whole row repairs become insufficient with additional spare rows being costly and inefficient.

Innovation Solution

Implementing segmented row repair by using multiplexer structures to independently repair segments of rows, allowing for multiple defects across different segments without the need for additional spare rows, thereby increasing repair capacity and yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If whole row repair is implemented, then repair capability for failed LAB rows is provided, but additional spare rows become costly and inefficient when multiple rows fail

Engineering Contradiction:
Improverepair capabilityVSAvoidspare row requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides each LAB row into multiple segments (e.g., four segments per row) with segment identification logic. This segmentation allows independent repair of individual segments rather than requiring whole row repair, enabling multiple failed rows to be repaired using the same spare row resource. The segment identifier logic tracks which segment is failed and routes repair operations accordingly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a segment dimension to the traditional row-based repair approach. Instead of treating repair as a one-dimensional row operation, it adds segment-level granularity, creating a two-dimensional repair space (row × segment). This allows the repair system to address multiple failed rows by operating at the segment level, effectively increasing repair capacity without adding proportional spare row resources.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple spare rows are added to handle multiple failures, then reliability increases, but device cost and complexity increase

Engineering Contradiction:
Improvehandling multiple failuresVSAvoidspare row overhead
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By segmenting rows into multiple repairable units, the patent enables a single spare row to service multiple failed rows through segment-level repair operations. The segment identifier logic and multiplexer structures allow the spare row to selectively repair segments from different failed rows, reducing the number of spare rows needed while maintaining the ability to handle multiple failures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The spare row is designed to perform multiple repair functions across different segments and rows. The universal repair logic can repair any segment in any row by receiving segment identification signals and routing repair operations appropriately. This multi-functionality allows one spare row to replace what would traditionally require multiple dedicated spare rows.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If segmented row repair is implemented, then repair capacity increases without additional spare rows, but device complexity increases due to segment logic

Engineering Contradiction:
Improverepair capacityVSAvoidsegment logic structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent implements segmentation with identification logic that tracks which segment within each row is failed. Each segment is assigned an identifier (e.g., segment 0-3), and the repair logic uses these identifiers to route repair operations to the correct segment. This structured segmentation approach increases repair capacity while keeping the added complexity organized and manageable through systematic identifier management.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces segment identifier logic as an intermediary between the failure detection mechanism and the repair execution mechanism. This intermediary component receives failure signals, determines which segment is affected, and routes the repair operation to the appropriate segment. This mediator layer manages the complexity by providing a systematic interface between detection and repair functions.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Ease of manufacture

If traditional whole row repair is used, then implementation is simple, but yield decreases when multiple rows fail

Engineering Contradiction:
Improverepair implementation simplicityVSAvoiddevice yield
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent divides rows into segments with associated identification logic, enabling repair of individual segments rather than entire rows. This segmentation allows the repair system to handle multiple failed rows using the same spare row resources, significantly improving device yield when defects occur in multiple rows. The segment-level repair capability transforms the repair process from a coarse whole-row operation to a fine-grained segment operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By adding the segment dimension to the repair operation, the patent creates a more sophisticated repair capability that can address multiple failed rows. The segment identifier logic and multiplexer structures enable the repair system to operate in a two-dimensional space (row × segment), increasing the number of repairable configurations without proportionally increasing complexity or resource requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12422477B2Segmented row repair for programmable logic devices
Publication Date: 2025.09.23 ALTERA CORP
  • US12422477B2 patent drawing
  • US12422477B2 patent drawing
  • US12422477B2 patent drawing

AI summary

Systems or methods of the present disclosure may provide a programmable logic device including multiple logic array blocks each having multiple programmable elements. The multiple logic array blocks are arranged in multiple rows that are segmented into multiple segments. The programmable logic device also includes repair circuitry disposed between the multiple segments. The repair circuitry remaps logic within a first segment of the multiple segments when a first logic array block of the multiple logic array blocks has failed. Moreover, the first segment includes the first logic array block.