Segmented Leadframe for Versatile Electronic Component Packaging

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Solution Overview

Problem

Existing electronic component packages lack versatility and efficiency in accommodating different semiconductor chip orientations and configurations, limiting their application and performance.

Innovation Solution

A package design featuring a leadframe with three electrically isolated sections, including L-shaped first and second sections for multiple wire bond positions and a third section for thermal management, allowing for various chip orientations and configurations within a compact, robust, and space-saving structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional leadframe design is used, then the structure is simple, but the versatility in accommodating different semiconductor chip orientations is limited

Engineering Contradiction:

Improveversatility in accommodating different semiconductor chip orientationsVSAvoidleadframe structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The leadframe is divided into three electrically isolated sections (first section with first L-shape, second section with second L-shape, and third section), allowing each section to serve different functional purposes and accommodate multiple chip orientations independently

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The leadframe structure provides multiple wire bond positions and supports various chip orientations (e.g., first orientation with first chip, second orientation with second chip), enabling a single leadframe design to serve multiple application scenarios

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple wire bond positions are provided for different chip orientations, then the adaptability increases, but the leadframe complexity increases

Engineering Contradiction:

Improvemultiple wire bond positions for different orientationsVSAvoidleadframe configuration complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The leadframe is segmented into three electrically isolated sections, where the first section includes a first L-shape with wire bond positions, the second section includes a second L-shape with wire bond positions, and the third section provides additional functionality, allowing multiple chip orientations to be supported through structured segmentation

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different sections of the leadframe have different local configurations optimized for specific functions: the first and second sections have L-shapes with wire bond positions for electrical connections, while the third section has a different configuration, providing localized functionality for different chip orientations and types

Inventive Principle:

Principle #3Local quality

3Volume of moving object

If a compact package structure is used, then the space efficiency improves, but the thermal management capability may be compromised

Engineering Contradiction:

Improvepackage volumeVSAvoidthermal management capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The leadframe is divided into three electrically isolated sections, with the third section specifically configured to provide thermal management functionality while maintaining the compact overall package structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The leadframe integrates multiple functions into a single component: electrical connections through the first and second L-shaped sections with wire bond positions, and thermal management through the third section, combining electrical and thermal management functions in one integrated structure

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10468337B2Package for an electronic component, electronic component and electronic arrangement

Publication Date: 2019.11.05 OSRAM OLED

AI summary

A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.