Segmented Leadframe Package Structure for High I/O Reliability
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Solution Overview
Problem
The increasing demand for advanced leadframe package structures with higher I/O counts and improved electrical performance poses challenges in achieving efficient packaging methods that enhance product reliability and simplify manufacturing processes.
Innovation Solution
A leadframe package structure and manufacturing method involving a metal sheet with patterned metal layers, dielectric layers, and photoresist masks to form a package body that encapsulates a chip, with optional area blocks for improved electrical connections and design flexibility, and a dielectric layer for structural reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of I/O pads is increased to meet higher I/O counts demand, then the electrical performance and product reliability need to be improved, but the package structure complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the metal sheet into multiple functional regions: a first metal layer with first metal blocks for electrical connection, a second metal layer with second metal blocks for additional I/O pads, and a third metal layer with a third metal block for grounding or power. This segmentation allows the package to achieve high I/O counts while maintaining organized structure and reliable electrical connections without excessive complexity.
2Reliability
If advanced leadframe packaging methods are adopted to achieve higher performance, then the electrical performance improves, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the metal sheet with multiple patterned metal layers and metal blocks before chip mounting. The first, second, and third metal layers are created with specific patterns and configurations in advance, allowing for optimized electrical performance while simplifying the subsequent chip assembly process, as the electrical connection structure is already prepared.
3Volume of moving object
If the package size is reduced to achieve smaller package, then the integration density increases, but the wiring length and heat dissipation challenges worsen
Solution Approach 1:
The patent transitions from traditional planar metal sheet configurations to a multi-layer three-dimensional structure. By stacking multiple metal layers (first, second, and third metal layers) vertically and creating metal blocks at different levels, the design achieves high integration density in a compact volume while providing multiple direct electrical connection paths that effectively reduce the equivalent wiring length and improve heat dissipation efficiency.
Data Source
AI summary
The package structure includes a metal sheet having a first central block, a plurality of first metal blocks, a second central block and a plurality of second metal blocks, a first finish layer and a second finish layer, at least a chip disposed on the metal sheet and a package body encapsulating the chip. The package structure may further include at least an area block for wire routing.