Segmented Lead Frame Semiconductor Package for Lower-Cost Cooling

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Solution Overview

Problem

The existing semiconductor device manufacturing methods result in high costs due to the need for heat dissipation through a metal base, which increases packaging costs.

Innovation Solution

A semiconductor device design featuring a metal plate with a base and terminal portion separated by a resin layer, where a semiconductor chip is mounted on the base portion, and electrically insulating layers and wires connect the chip to the terminal portion, allowing for cost-effective manufacturing by using a lead frame with regions that can be cut to form individual devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal base is used for heat dissipation in semiconductor packaging, then heat dissipation performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The metal plate is segmented into a base portion and a terminal portion that are separated from each other, allowing independent optimization of heat dissipation and electrical connection functions while reducing material usage and manufacturing complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin layer serves multiple functions simultaneously: it provides electrical insulation between the metal plate and surrounding components, provides mechanical support and structural stability, and enables cost-effective manufacturing by eliminating the need for separate insulating structures

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If a resin layer surrounds the metal plate to provide insulation, then electrical insulation is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical insulationVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The resin layer serves multiple functions simultaneously: it provides electrical insulation between the metal plate and surrounding components, provides mechanical support and structural stability, and simplifies manufacturing by integrating multiple functions into a single component rather than requiring separate insulating structures

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The resin layer is selectively applied in specific regions where insulation is needed, rather than uniformly surrounding the entire metal plate, thereby providing necessary insulation while minimizing added complexity and material usage

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If the metal plate base and terminal portion are separated, then component arrangement flexibility is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvecomponent arrangement flexibilityVSAvoidalignment precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The resin layer is formed in advance to define precise positions and orientations of the metal plate base portion and terminal portion, establishing accurate alignment references before subsequent assembly steps, thereby reducing the actual manufacturing precision requirements during final assembly

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs while maintaining effective heat dissipation and high-frequency characteristics, enabling the production of semiconductor devices with improved cost efficiency and component arrangement flexibility.

Implementation Method 1

a resin layer provided between the base portion and the terminal portion... a first electrically insulating layer provided on the metal plate and the resin layer

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

heat dissipation... maintaining effective heat dissipation

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Implementation Method 3

one or more wires provided on the first electrically insulating layer and including at least one wire configured to electrically connect the semiconductor chip and the terminal portion to each other

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20230290752A1Semiconductor device and method of manufacturing the same

Publication Date: 2023.09.14 SUMITOMO ELECTRIC INDUSTRIES LTD

AI summary

A semiconductor device includes a metal plate having a base portion and a terminal portion separated from the base portion, a resin layer provided between the base portion and the terminal portion and so as to surround the metal plate in a planar direction, and at which an upper and a lower surface of each of the base portion and the terminal portion are exposed, a semiconductor chip mounted on the base portion, a first electrically insulating layer provided on the metal plate and the resin layer so as to cover the semiconductor chip, and one or more wires provided on the first electrically insulating layer and including at least one wire configured to electrically connect the semiconductor chip and the terminal portion to each other.