Segmented External Connecting Parts for LED Heat Dissipation
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Solution Overview
Problem
Conventional light emitting elements face issues with heat dissipation and thermal stress, which can lead to breakage of the insulating film and electrodes when large-area external connecting parts are used, causing damage during bonding to a substrate.
Innovation Solution
A light emitting element design featuring a semiconductor layered body with exposed parts on the first semiconductor layer, surrounded by fragmented first external connecting parts and a second external connecting part, which improves heat dissipation while minimizing stress on the insulating film and electrodes, allowing for secure bonding to a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large-area external connecting parts are used to ensure heat dissipation, then heat dissipation performance is improved, but thermal stress concentration causes breakage of insulating film and electrodes
Solution Approach 1:
The external connecting parts are divided into multiple smaller fragmented regions instead of using large continuous areas. These fragmented external connecting parts are distributed around the exposed parts of the first semiconductor layer, reducing stress concentration while maintaining total heat dissipation area. The segmentation allows heat to be dissipated through multiple distributed pathways rather than through large continuous structures that generate concentrated thermal stress.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the external connecting parts are positioned at specific locations around the exposed semiconductor layer regions, with each local area having optimized connectivity. This local quality approach ensures that heat dissipation occurs at strategically positioned regions while avoiding stress concentration in critical areas where the insulating film and electrodes are vulnerable.
2Temperature
If large-area external connecting parts are provided on exposed n-type semiconductor layer, then heat dissipation is improved, but thermal stress concentrates around exposed regions causing breakage
Solution Approach 1:
The external connecting parts are segmented into multiple smaller units distributed around the exposed semiconductor regions. This segmentation distributes the thermal stress across multiple discrete locations rather than concentrating it in large continuous areas, preventing breakage of the insulating film and electrodes while maintaining effective heat dissipation through the distributed connecting parts.
Solution Approach 2:
The fragmented external connecting parts act as intermediary structures between the exposed semiconductor layer and the heat dissipation path. These intermediaries are positioned at optimal locations to facilitate heat transfer while mechanically decoupling the stress transmission path, thereby protecting the vulnerable insulating film and electrode regions from thermal stress concentration.
3Temperature
If external connecting parts are positioned close to exposed parts, then heat dissipation efficiency is improved, but stress on insulating film and electrodes increases
Solution Approach 1:
The external connecting parts are positioned at locally optimized positions around the exposed semiconductor regions, with each local area having connecting parts placed where they can efficiently conduct heat while maintaining adequate distance from the most stress-vulnerable regions. This local quality optimization balances heat dissipation efficiency with stress resistance in each specific location.
Solution Approach 2:
The connecting parts are segmented and distributed at multiple locations around the exposed regions rather than placed as large continuous structures immediately adjacent to the exposed parts. This segmentation allows the system to achieve heat dissipation efficiency through distributed proximity while the fragmented nature reduces stress concentration on the insulating film and electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and reduces the likelihood of insulating film and electrode breakage, ensuring stable and efficient light extraction while maintaining structural integrity during bonding.
Implementation Method 1
the first external connecting parts and at least one second external connecting part... enhances heat dissipation
Data Source
Figure 1A
Figure 1B~1C
Figure 2A~2B
AI summary
A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.