Segmented LED Interconnect Layout for Dense Addressable Arrays
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Solution Overview
Problem
Existing technologies face challenges in providing reliable interconnections for densely packed light-emitting diodes (LEDs) or lasers, particularly when each device must be separately addressable.
Innovation Solution
A segmented LED interconnect system is developed, featuring a plurality of LED segments with p-type and n-type layers, optically transparent conductive lines attached to multiple n-layers, and conductive lines attached to multiple p-layers, allowing for addressable connections using a crossbar or other electrical connection schemes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LEDs are densely packed to increase output, then light emission capability is improved, but interconnection reliability deteriorates due to space constraints and heat management issues
Solution Approach 1:
The LED array is divided into multiple independently addressable segments or pixels, each with its own n-type and p-type contacts. This segmentation allows individual control of each LED element while maintaining dense packing, as demonstrated in the patent where multiple LED segments are formed on a single substrate with separate electrical pathways for each segment.
Solution Approach 2:
The patent transitions from planar interconnections to three-dimensional vertical contacts by forming n-type and p-type contacts at opposite ends of each LED segment. This vertical arrangement in the third dimension allows for better heat dissipation and electrical isolation while maintaining high density in the two-dimensional plane.
2Measurement precision
If separate addressability is implemented for each LED to enable selective emission, then control precision is improved, but device complexity worsens due to increased interconnection requirements
Solution Approach 1:
Each LED is segmented into independently controllable units with separate n-type and p-type contacts, enabling individual addressing through row and column control schemes. The patent demonstrates this by forming multiple isolated LED segments that can be selectively activated through independent electrical pathways.
Solution Approach 2:
The patent introduces intermediate conductive layers and isolation structures that mediate between the control signals and individual LED elements. These intermediary components simplify the control architecture by providing systematic pathways for addressing multiple LEDs without requiring complex individual wiring for each element.
3Illumination intensity
If transparent conductive layers are used to maintain optical clarity, then light transmission is improved, but electrical conductivity worsens compared to traditional metal contacts
Solution Approach 1:
The patent employs composite contact structures combining transparent conductive oxides (such as ITO or AZO) with metallic layers or graphene. This composite approach maintains optical transparency while enhancing electrical conductivity, as the metallic or graphitic components provide superior conductive pathways without compromising light transmission properties.
Solution Approach 2:
The patent optimizes the thickness, doping concentration, and material composition of transparent conductive layers to achieve the desired balance between transparency and conductivity. By adjusting these parameters, the system achieves sufficient electrical performance while maintaining optical clarity for the LED emission.
Data Source
Figure 1A
Figure 1B~1C
Figure 1D~1E
AI summary
A light emitting diode (LED) may include a conductive via in a first portion of an epitaxial layer and a first contact on a second portion of the epitaxial layer. The first portion and the second portion may be separated by an isolation region. The LED may include a transparent conductive layer on the epitaxial layer.