Segmented Lid Structure for Semiconductor Package Warpage Control

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Solution Overview

Problem

Warpage and stress occur in semiconductor devices due to mismatched Coefficient of Thermal Expansion (CTE) between different materials during thermal processes, leading to issues like shorting and open circuits when bonded to a printed circuit board.

Innovation Solution

A lid with stiffness adjustment grooves is applied to the semiconductor package, which matches the convex or concave profile of the device, ensuring uniform thermal interface material distribution and reducing warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a lid is applied to match the convex or concave profile of the semiconductor device, then warpage is reduced and thermal interface material adherence is improved, but the device complexity increases due to the need for stiffness adjustment grooves

Engineering Contradiction:

Improvewarpage reductionVSAvoidlid structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The lid is segmented into multiple foot segments laterally spaced apart from one another, with stiffness adjustment grooves dividing the foot portion into discrete segments. This segmentation allows each segment to independently conform to the semiconductor device profile while reducing overall warpage, balancing reliability improvement with manageable structural complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The lid features non-uniform thickness and localized stiffness adjustment grooves that create varying rigidity across different regions. The foot portions have reduced thickness and incorporated grooves to provide flexibility for matching the convex or concave profile, while the cover portion maintains sufficient rigidity for structural support, applying local quality to resolve the contradiction between warpage reduction and overall complexity.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If the foot segments are laterally spaced apart from one another, then uniform thermal interface material distribution is achieved, but the mechanical strength of the lid decreases

Engineering Contradiction:

Improvethermal interface material distribution uniformityVSAvoidlid mechanical strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The cover portion acts as an intermediary structural element that connects the laterally spaced foot segments. While the foot segments are spaced apart to enable uniform thermal interface material distribution, the cover portion provides spanning support that maintains overall mechanical strength, mediating between the need for material uniformity and structural integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The lid is constructed as a composite structure with the cover portion and foot portions integrated into a single piece of material with varying thickness. This composite design allows the foot segments to be laterally spaced for uniform thermal interface material distribution while the integrated construction and varying thickness profile maintain sufficient mechanical strength.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the lifespan and reliability of the semiconductor device by minimizing warpage and improving thermal interface material adherence, thus preventing delamination and enhancing heat dissipation.

Implementation Method 1

Warpage and stress may occur during the thermal process due to the mismatch in Coefficient of Thermal Expansion (CTE) between different materials and different package components

Methodology Applied

Scientific EffectCoefficient of Thermal Expansion (CTE) mismatch: Thermal Expansion

Implementation Method 2

The cover portion of the lid is attached to the package through the thermal interface material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250309033A1Semiconductor device

Publication Date: 2025.10.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor device including a package, a lid and a thermal interface material is provided. The package includes a packaging substrate, semiconductor dies and an insulating encapsulation, wherein the semiconductor dies are disposed on and electrically connected to the packaging substrate, and the insulating encapsulation encapsulates the semiconductor dies. The lid is disposed on the packaging substrate, the lid includes a cover portion and foot portion extending from the cover portion to the packaging substrate, wherein the cover portion covers the semiconductor dies and the insulating encapsulation, the foot portion includes foot segments laterally spaced apart from one another, and the foot segments are attached to the packaging substrate. The cover portion of the lid is attached to the package through the thermal interface material.