Segmented Planar Light Emitter Layout to Reduce Heat-Bonding Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting modules face manufacturing complexity and reliability issues due to warping caused by differing linear expansion coefficients between the plate-like body and the base board during heat bonding, affecting the module's quality and ease of production.
Innovation Solution
A light emitting module design featuring a base board with conductive, flexible, and insulating parts, where divisional planar light emitters are disposed on the base board with through-holes for electrical connections, and a sealing part to reduce warping by using low elasticity materials and controlled curing temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat bonding is performed to join the plate-like body and base board, then manufacturing complexity is reduced, but warping occurs due to different linear expansion coefficients
Solution Approach 1:
The plate-like body is divided into multiple smaller plate-like bodies, each containing a reduced number of light emitting elements. This segmentation reduces the overall size of each plate-like body, thereby minimizing warping during heat bonding while still achieving the desired light emission area through arrangement of multiple segmented units.
2Reliability
If light emitting elements are mounted on base board and sealed with sealing resin, then light emission function is achieved, but manufacturing complexity increases
Solution Approach 1:
Multiple light emitting elements are mounted on a single plate-like body and sealed together with sealing resin to form an integrated unit. This merging approach combines multiple elements into one assembly, reducing the number of separate mounting and sealing operations required, thereby simplifying manufacturing while maintaining light emission functionality.
3Area of stationary object
If plate-like body is made larger to include more light emitting elements, then light emission area increases, but warping increases due to heat bonding
Solution Approach 1:
The light emission area is achieved by arranging multiple small plate-like bodies in a configured layout rather than using a single large plate-like body. Each small plate-like body maintains minimal warping, while the collective arrangement of multiple segments provides the required total light emission area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the production of high-quality light emitting modules with reduced warping and improved manufacturing ease, ensuring reliable and uniform light emission without significant deviations in optical axes.
Implementation Method 1
as the plate-like body and the base board have different linear expansion coefficients, there is a concern that warping of the plate-like body may occur in the event of heat bonding
Implementation Method 2
curing the plate-like structure by pressing and heating upper and lower surfaces of the plate-like structure
Data Source
AI summary
A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.