Segmented Light Source Module Heat Sink for Vehicle Headlamps

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Solution Overview

Problem

The existing methods for manufacturing light source modules for vehicle headlamps require a new mold for each vehicle model, leading to high manufacturing and investment costs due to the need for customized heat sink structures.

Innovation Solution

A standardized light source module structure featuring a frame with multiple mounting surfaces and heat dissipaters, allowing for flexible attachment of heat dissipaters to accommodate different vehicle models, reducing the need for multiple molds and enabling mass production of heat sink structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a customized heat sink structure is designed for each vehicle model, then the heat dissipation efficiency is improved, but the manufacturing cost and investment cost increase due to the need for multiple molds

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The heat sink structure is divided into a standardized frame and multiple interchangeable heat dissipaters. The frame provides a common mounting platform while different heat dissipaters can be attached based on specific vehicle model requirements, allowing customized heat dissipation solutions without requiring customized molds for each model.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized frame structure with multiple mounting surfaces can accommodate different types of heat dissipaters for different vehicle models. This universal base structure reduces the need for multiple specialized molds while maintaining the ability to provide model-specific heat dissipation performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If a standardized heat sink structure is used across different vehicle models, then the manufacturing cost is reduced, but the heat dissipation efficiency may be compromised

Engineering Contradiction:
Improvemanufacturing costVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

By segmenting the heat sink into a universal frame and model-specific heat dissipaters, the standardized frame maintains manufacturing efficiency while the interchangeable heat dissipaters ensure optimized heat dissipation for each vehicle model's specific requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system allows dynamic configuration where different heat dissipaters can be attached to the standardized frame depending on the vehicle model, enabling the heat dissipation system to adapt to different thermal requirements while using a common manufacturing platform.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If multiple customized molds are manufactured for different vehicle models, then the design requirements for each model are met, but the investment cost and management complexity increase

Engineering Contradiction:
Improvedesign adaptabilityVSAvoidmold management complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The mold investment is segmented into one standardized frame mold and multiple smaller heat dissipater molds. This reduces the overall complexity compared to creating entirely customized molds for each vehicle model, while still allowing design adaptability through the interchangeable heat dissipaters.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized frame mold serves multiple vehicle models universally, reducing the total number of molds required. Only the heat dissipater portions need model-specific customization, significantly simplifying mold management compared to fully customized approaches.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of operation

If a standardized frame structure with multiple mounting surfaces is used, then the ease of assembly and maintenance is improved, but the structural complexity of the frame increases

Engineering Contradiction:
Improveassembly easeVSAvoidframe structural complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The frame's multiple mounting surfaces are strategically positioned to accommodate different heat dissipater configurations. This segmentation of mounting locations provides assembly flexibility and ease of maintenance while keeping the overall frame structure relatively simple and standardized.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for the use of a common heat sink structure across various vehicle models, reducing manufacturing costs and investment by eliminating the need for separate molds for each model, while maintaining efficient heat dissipation and accommodating diverse design structures.

Implementation Method 1

a plurality of heat dissipaters respectively disposed on the plurality of mounting surfaces and extending to cover one of the side surfaces of the frame

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9857042B2Light source module and lighting device having same
Publication Date: 2018.01.02 SAMSUNG ELECTRONICS CO LTD
  • US9857042B2 patent drawing
  • US9857042B2 patent drawing
  • US9857042B2 patent drawing

AI summary

A light source module includes a frame having a plurality of mounting surfaces at different levels and side surfaces respectively connected to the plurality of mounting surfaces; a plurality of heat dissipaters respectively disposed on the plurality of mounting surfaces and extending to cover a side surface of the frame; and a light source including a plurality of light emitting devices respectively disposed on the plurality of heat dissipaters and respectively positioned above the plurality of mounting surfaces.