Segmented Mask Structure for Deposition Film Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, precise control of the film suppression area during film deposition processes is challenging due to material film accumulation at the inner edge of the clamp ring, leading to issues like film peeling at the wafer edge.
Innovation Solution
A mask structure for a deposition device is introduced, comprising first segments arranged around a central axis and separated from each other, and second segments overlapping the adjacent first segments vertically. This configuration allows for precise control of the film suppression area by adjusting the positions of the segments between deposition processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a clamp ring is used to cover the outer peripheral area of the wafer, then film suppression area is defined, but material film accumulates at the inner edge of the clamp ring leading to imprecise control of film suppression area
Solution Approach 1:
The clamp ring is divided into multiple first segments arranged in a circle around the central axis, with gaps between adjacent segments. This segmentation allows the mask structure to adapt to wafer curvature and prevents material film accumulation at the inner edge, thereby improving film suppression area control precision while maintaining manageable device complexity through modular design
Solution Approach 2:
The invention introduces a vertical dimension by adding second segments that overlap the first segments in the vertical direction. This multi-dimensional arrangement creates a more precise film suppression area control mechanism, where the overlapping segments work together to define the suppression boundary more accurately without requiring excessive complexity in the horizontal plane
2Reliability
If a clamp ring is used to cover the outer peripheral area, then film suppression area is defined, but film peeling occurs at the edge of the wafer
Solution Approach 1:
The mask structure incorporates movable segments that can be adjusted in position along the vertical direction. The second segments can move relative to the first segments, allowing dynamic adjustment of the film suppression area. This dynamic capability prevents film peeling by optimizing the suppression boundary for different process conditions while maintaining ease of operation through straightforward vertical movement mechanisms
Solution Approach 2:
By segmenting the clamp ring into multiple independent first and second segments, the structure gains flexibility to adapt to wafer edge curvature variations. This segmentation prevents film peeling by ensuring uniform suppression across the wafer periphery while allowing individual segments to be positioned independently for optimal performance
3Manufacturing precision
If material film accumulates at the inner edge of the clamp ring, then film suppression area control is affected, but the clamp ring structure remains simple
Solution Approach 1:
The clamp ring is segmented into multiple first segments with gaps between them, preventing continuous material film accumulation at the inner edge. This segmentation approach achieves precise film suppression area control by allowing the mask structure to conform to the wafer curvature, while the modular segmented design keeps the overall device complexity manageable through standardized repeating units
Solution Approach 2:
The addition of second segments in the vertical direction creates a multi-layered mask structure that precisely defines the film suppression area. This vertical dimension adds precision by creating overlapping coverage zones, while the systematic arrangement of segments in both horizontal and vertical dimensions maintains device complexity at acceptable levels through patterned repetition
Data Source
AI summary
A mask structure for a deposition device includes first segments and second segments. The first segments are arranged in a direction surrounding a central axis and separated from one another. The second segments are disposed above the first segments. Each of the second segments overlaps two of the first segments adjacent to each other in a vertical direction parallel to an extending direction of the central axis. A deposition device includes a process chamber, a stage, and the mask structure. The stage is at least partially disposed in the process chamber and includes a holding structure of a substrate. The mask structure is disposed in the process chamber, located over the stage, and covers a peripheral region of the substrate to be held on the stage. An operation method of the deposition device includes horizontally adjusting positions of the first segments and the second segments respectively between different deposition processes.