Segmented Mask Substrate for Lithography Cost Reduction
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Solution Overview
Problem
The high cost and time-consuming process of developing and re-designing masks for photo lithography in manufacturing thin-film transistors, liquid crystal displays, and OLED displays hinder the development of new products.
Innovation Solution
A novel mask substrate is introduced, comprising a first substrate and a patterned substrate, where the width of the first substrate is greater than or equal to the width of the patterned substrate. This mask substrate is used in conjunction with a base and a conductive layer to pattern the conductive layer through exposure and development processes, allowing for efficient formation of electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional masks are used for photo lithography, then patterning can be achieved, but the cost and time for developing and re-designing masks are high
Solution Approach 1:
The mask substrate is divided into two distinct parts: a first substrate providing mechanical support and a second substrate containing the pattern. This segmentation allows the patterned second substrate to be reused across multiple first substrates, eliminating the need to re-design masks for each new product while reducing development costs and time.
Solution Approach 2:
The second substrate with the pattern is designed to be universally applicable across multiple first substrates. By separating the reusable patterned component from the disposable support substrate, the same patterned second substrate can serve multiple manufacturing purposes, reducing the need for continuous mask re-design and development.
2Strength
If the first substrate width is increased to provide adequate support, then structural strength is improved, but the overall mask substrate size increases
Solution Approach 1:
The first substrate is designed with a width that is locally sufficient to provide the necessary mechanical support and handling strength, but not excessively large. The patterned second substrate is positioned on this optimally-sized first substrate, ensuring that the mask substrate has adequate strength for manufacturing while minimizing the overall area and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the novel mask substrate reduces the complexity and cost associated with mask development, enabling faster and more efficient production of electronic devices while improving light transmittance and structural strength.
Implementation Method 1
performing exposure and development processes on the conductive layer for patterning the conductive layer
Data Source
AI summary
An electronic device is provided. The electronic device includes a base and a conductive layer that is disposed on the base and patterned by a plurality of processes. The plurality of processes include providing a mask substrate. The mask substrate includes a first substrate and a patterned substrate. In the cross-sectional view, the width of the first substrate is greater than or equal to the width of the patterned substrate. The plurality of processes include arranging the mask substrate and the base correspondingly. The plurality of processes also include performing exposure and development processes on the conductive layer for patterning the conductive layer, and removing the mask substrate.