Segmented Memory Case for In-Vehicle Server Heat and Dust Control

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Solution Overview

Problem

Existing in-vehicle servers face challenges in efficiently dissipating heat and preventing dust ingress while accommodating memory modules due to structural limitations imposed by support boards, making it difficult to design a case that can be smoothly inserted and fixed to memory slots.

Innovation Solution

A memory case design with a first and second case body, where the length of the first case body in the third direction differs from the second, allowing one body to abut against the memory slot edge, and a securing mechanism to maintain structural integrity, combined with heat conducting and shock-absorbing pads for efficient heat dissipation and vibration resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a memory case is designed to fit within tight structural constraints of in-vehicle servers, then adaptability to server structure is improved, but structural strength may be compromised

Engineering Contradiction:
Improveadaptability to server structureVSAvoidstructural strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The memory case is divided into a first case body and a second case body that are combined together. This segmentation allows each part to be optimized independently - the first case body can be designed to abut against the memory slot edge for adaptability, while the second case body provides additional structural support to maintain overall strength

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first case body and second case body have different lengths in the third direction, creating an asymmetric structure. This asymmetry enables the shorter first case body to precisely abut against the memory slot edge for optimal adaptability, while the longer second case body extends to provide enhanced structural rigidity and strength

Inventive Principle:
Principle #4Asymmetry

2Ease of operation

If the memory case is made compact to fit in-vehicle server constraints, then ease of installation is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improveease of installationVSAvoidheat dissipation capability
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The memory case utilizes multiple dimensions strategically - the first and second case bodies extend in the first direction to provide installation ease, while their combination creates vertical stacking (second direction) and depth variation (third direction) that establishes heat dissipation pathways, effectively using dimensional space for both installation and thermal management

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the memory case structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but dust prevention effectiveness deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoiddust prevention effectiveness
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The case is segmented into two bodies that can be manufactured separately using standard processes, then combined to form a complete enclosure. This segmentation maintains manufacturing simplicity while the joined structure creates effective dust prevention barriers around the memory slot and memory component

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves effective heat dissipation and dust prevention for memory modules in an in-vehicle environment, adapting to structural constraints and ensuring stable operation by maintaining structural strength and reducing resonance from vibrations.

Implementation Method 1

heat conducting and shock-absorbing pads for efficient heat dissipation

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

shock-absorbing pads for efficient heat dissipation and vibration resistance

Methodology Applied
Scientific EffectVibration absorption: Damping

Data Source

PatentUS12464671B2Memory case and server
Publication Date: 2025.11.04 BEIJING TUSEN WEILAI TECH CO LTD
  • US12464671B2 patent drawing
  • US12464671B2 patent drawing
  • US12464671B2 patent drawing

AI summary

A memory case includes a first case body and a second case body. The first case body includes a first extension part extending in a first direction, and the second case body includes a second extension part extending in the first direction. The first case body and the second case body are combined in a second direction to form an interior space for accommodating a memory, and the first extension part secures the second extension part. A length of the first case body in a third direction is different from a length of the second case body in the third direction. The memory module of the server includes a memory slot, a memory, and the above-mentioned memory case. The memory is mounted on the memory slot, and the memory case accommodates the memory.