Segmented Nozzle Module for Selective LED Mis-Assembly Removal
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Solution Overview
Problem
Current methods for assembling semiconductor light-emitting elements in displays face challenges with mis-assembly, particularly in self-assembly environments like fluids, where it is difficult to remove mis-assembled elements without affecting adjacent correctly assembled ones.
Innovation Solution
A module and method using a fluid supply system with a housing and partitioned nozzle to selectively remove mis-assembled semiconductor light-emitting elements by injecting fluid at the mis-assembly site, utilizing an electric and magnetic field for positioning and a transfer unit for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly is used to assemble semiconductor light-emitting elements in a fluid, then productivity is improved, but mis-assembly occurs making it difficult to remove erroneous elements
Solution Approach 1:
The nozzle is divided into multiple independent nozzle holes arranged in a matrix pattern, allowing selective fluid injection at specific locations. This segmentation enables targeted removal of mis-assembled elements without affecting adjacent correctly assembled ones, resolving the contradiction between high-speed self-assembly and assembly accuracy.
Solution Approach 2:
The fluid injection is applied locally only at positions where mis-assembled elements are detected, rather than uniformly across the entire assembly area. This localized approach maintains high productivity by preserving correctly assembled elements while selectively correcting errors, thus improving assembly accuracy without sacrificing speed.
2Reliability
If fluid is injected to remove mis-assembled elements, then mis-assembly is corrected, but adjacent correctly assembled elements may be separated
Solution Approach 1:
The nozzle structure is segmented into multiple discrete nozzle holes spaced at specific intervals. This segmentation allows the fluid injection to be confined to specific locations, preventing the fluid from affecting adjacent correctly assembled elements and thus avoiding unwanted separation while still correcting mis-assemblies.
Solution Approach 2:
The fluid acts as an intermediary tool for removal, but its application is controlled through the segmented nozzle structure that mediates between the injection source and the assembly area, limiting the fluid's impact zone to only where mis-assembled elements are present.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively isolates the mis-assembly site from adjacent elements, preventing separation of correctly assembled ones and ensuring accurate removal of mis-assembled elements, enhancing the yield and accuracy of the self-assembly process.
Implementation Method 1
a fluid supply unit to supply a fluid... allowing communication between an inner space of the housing and an inner space of the chamber to inject the fluid supplied from the fluid supply unit to a site in which the semiconductor light-emitting element is mis-assembled
Implementation Method 2
semiconductor light-emitting elements introduced into a fluid accommodated in a chamber are self-assembled in cells of the assembly substrate arranged in a matrix form by using an electrical field and a magnetic field
Implementation Method 3
semiconductor light-emitting elements introduced into a fluid accommodated in a chamber are self-assembled in cells of the assembly substrate arranged in a matrix form by using an electrical field and a magnetic field
Data Source
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AI summary
According to an embodiment of the present invention, a removal module using an electric field and a magnetic field so as to self-assemble, on cells arranged in a matrix form of an assembly substrate, semiconductor light-emitting elements introduced in a fluid accommodated in a chamber, and then remove a semiconductor light-emitting element mis-assembled with the assembly substrate comprises: a fluid supply unit for supplying the fluid; and a housing of which one side is connected to the fluid supply unit, an upper plate is adjacent to the assembly substrate, and a lower plate is adjacent to the chamber, wherein the upper plate has: a nozzle hole allowing communication between the inner space of the housing and the inner space of the chamber so that the fluid supplied from the fluid supply unit is injected at a site in which the semiconductor light-emitting element is mis-assembled on the assembly substrate; and one pair of partition parts facing each other with the nozzle hole as the center thereof.