Segmented Nozzle for Hermetic MEMS Packaging
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Solution Overview
Problem
The challenge in packaging semiconductor devices, such as MEMS and DMDs, is the difficulty in achieving a hermetic seal due to the small dimensions and close proximity of the devices, which leads to light leaks and incomplete encapsulation, as traditional nozzles struggle to access and dispense sealant materials effectively between adjacent devices.
Innovation Solution
A nozzle with multiple dispensing orifices along its sidewall, capable of horizontal spraying, is used to apply a sealant like epoxy resin between packaged devices before singulation, allowing for precise and consistent dispensing of controlled amounts of liquid parallel to the wafer substrate, improving the hermetic seal and reducing optical artifacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional nozzles are used to dispense sealant materials, then the dispensing process is simple, but the nozzle cannot access tight spaces between closely spaced devices, resulting in incomplete encapsulation and light leaks
Solution Approach 1:
The nozzle is segmented into multiple dispensing orifices arranged in a matrix array, allowing the sealant to be applied at multiple locations simultaneously. This segmentation enables the nozzle to cover the tight spaces between closely spaced devices effectively, achieving complete encapsulation without requiring a single complex long nozzle.
Solution Approach 2:
The dispensing orifices are arranged in a matrix array that extends in multiple dimensions, allowing the nozzle to dispense sealant in a two-dimensional pattern rather than a single linear path. This dimensional approach enables coverage of the entire device periphery and inter-device spaces in one positioning action.
2Productivity
If devices are placed in close proximity to increase productivity, then manufacturing efficiency improves, but light leaks occur due to incomplete sealing between devices
Solution Approach 1:
The matrix array of dispensing orifices is segmented into multiple rows and columns that can be positioned to seal between multiple adjacent devices simultaneously. This allows high-density device placement while maintaining complete hermetic seals between each device, preventing light leaks even in tightly packed configurations.
Solution Approach 2:
Multiple sealing functions are merged into a single nozzle operation. The matrix array of orifices combines multiple dispensing points into one integrated component that can seal between several devices in one action, achieving both high productivity through parallel sealing and reliable hermetic integrity across all device interfaces.
3Manufacturing precision
If a single dispensing orifice is used, then the nozzle structure is simple, but it cannot dispense controlled amounts of liquid precisely in tight spaces
Solution Approach 1:
The single dispensing orifice is segmented into multiple smaller orifices arranged in a matrix array. Each orifice can dispense controlled amounts of liquid precisely, and the collective array provides comprehensive coverage. The segmented structure maintains relative simplicity while achieving superior dispensing precision compared to a single large orifice.
Solution Approach 2:
Different regions of the nozzle have different dispensing characteristics through the matrix array configuration. Each orifice in the array can be optimized for local dispensing requirements, providing tailored material application precision for specific areas between devices while maintaining overall structural simplicity.
Data Source
AI summary
Microelectromechanical systems (MEMS) such as digital micromirror devices (DMD) are manufactured in arrays. Covers, packages, and lids are placed around each device and a liquid such as epoxy resin is dispensed around the packaged device. The epoxy resin acts as a sealant to form a hermetic seal. A nozzle comprises multiple orifices along a sidewall of the nozzle to dispense the epoxy resin horizontally and parallel to the plane of the wafer substrate. The distal ends of the nozzle are enclosed.