Segmented Package Lid for Multi-Die Heat Dissipation
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in integrating multiple semiconductor devices while addressing the demands for miniaturization, higher speed, and improved electrical performance, particularly in terms of lower transmission and insertion loss.
Innovation Solution
A package lid structure for semiconductor devices is introduced, featuring a roof, footing, island, and ribs, which enhances thermal dissipation and mechanical stability by detaching the island from the footing, allowing for efficient heat management and increased resistance to mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the island is connected to the footing, then mechanical strength is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The package lid is segmented into an island portion and a footing portion that are spatially separated. The island portion is positioned over the high-power semiconductor die while the footing portion is bonded to the substrate, with a gap between them. This segmentation allows the island to serve as a dedicated thermal management structure without being mechanically constrained by the footing, thereby enabling effective heat dissipation while maintaining adequate mechanical strength through the overall package lid design.
2Adaptability or versatility
If multiple semiconductor devices are integrated, then functionality is improved, but manufacturing complexity increases
Solution Approach 1:
The package lid is divided into functionally distinct segments: an island portion for thermal management over high-power dies and a footing portion for mechanical bonding to the substrate. This segmentation allows different regions of the package lid to be optimized for different functions, enabling the integration of multiple semiconductor devices with diverse requirements without requiring a completely different package design for each configuration.
Solution Approach 2:
The package lid structure serves multiple functions simultaneously: the island portion provides thermal management for high-power devices, the footing portion provides mechanical support and electrical bonding, and the overall structure accommodates multiple semiconductor devices with different power requirements. This multi-functionality reduces manufacturing complexity by using a single package lid design for diverse device integration scenarios.
3Stability of the object's composition
If the package lid is bonded directly to the substrate, then mechanical stability is improved, but heat dissipation to high-power dies deteriorates
Solution Approach 1:
The package lid is segmented into an island portion and a footing portion with distinct functions. The footing portion is bonded to the substrate to provide mechanical stability, while the island portion is positioned over the high-power semiconductor die to provide thermal management. The spatial separation between the island and footing allows each to optimize its function without compromising the other.
Solution Approach 2:
Different regions of the package lid have different properties and functions. The island portion is positioned and sized to match the high-power die footprint for optimal thermal contact, while the footing portion is designed for mechanical bonding to the substrate. This local optimization of structure and function in different regions enables simultaneous achievement of mechanical stability and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package lid structure effectively dissipates heat generated by high-power semiconductor dies and reduces mechanical stress, thereby enhancing manufacturing yield and reliability of semiconductor devices.
Implementation Method 1
A first thermal interface material is disposed on a rear surface of the first semiconductor die
Implementation Method 2
A first adhesive is disposed on the circuit substrate. The first adhesive encircles the first semiconductor die
Data Source
AI summary
A semiconductor device includes a first semiconductor die, a second semiconductor die and a package lid. The package lid is disposed over the first semiconductor die and the second semiconductor die. The package lid includes a roof and an island. The roof extends along a first direction and a second direction perpendicular to the first direction and includes a first portion and a second portion. The island protrudes from the first portion of the roof, wherein the island covers and is thermally connected to the first semiconductor die, and the second portion of the roof covers and is physically separated from the second semiconductor die.