Segmented Package Paddle IC Packaging for Thermal and Electrical Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in creating high-density, high-performance integrated circuit packages that are smaller in size while maintaining or increasing electrical connections and reliability, as existing solutions fail to efficiently support the growing demand for more complex and faster electronic products with reduced costs and improved yields.
Innovation Solution
The method involves forming a package paddle group with electrically isolated paddles, attaching an integrated circuit device, forming standoff terminals, connecting paddle connectors, and encapsulating the components to provide precise electrical connections and structural support, optimizing power and ground isolation, thermal contact, and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet smaller product requirements, then product size decreases, but the number of electrical connections must increase to maintain functionality
Solution Approach 1:
The package paddle is divided into multiple electrically isolated segments (first package paddle and second package paddle) that can be independently connected to different circuit boards. This segmentation allows multiple electrical connections to be achieved within a compact footprint, resolving the contradiction between reduced package size and increased connection requirements.
2Quantity of substance
If more package connectors are added to support increasing electrical connections, then electrical connection capacity increases, but package complexity increases
Solution Approach 1:
The package paddle structure serves multiple functions simultaneously: it provides mechanical support, electrical isolation between circuits, thermal management pathways, and multiple electrical connection points through its segmented design. This multi-functionality increases connection capacity without proportionally increasing structural complexity.
3Quantity of substance
If electrical connections are placed closer together to increase density, then connection density increases, but precision requirements for placement increase
Solution Approach 1:
By segmenting the package paddle into electrically isolated sections with defined geometric boundaries, the invention creates naturally spaced connection zones that maintain appropriate electrical clearance. The segmented structure provides physical references for connector placement, reducing the need for ultra-precise positioning while achieving high connection density.
4Volume of moving object
If package size is reduced, then product size decreases, but thermal management challenges increase
Solution Approach 1:
The package paddle structure implements local quality variations with different thermal conductivities in different regions. The metal package paddle provides high thermal conductivity pathways for heat dissipation, while the encapsulation material provides thermal isolation where needed. This localized thermal management allows effective heat control within a reduced package volume.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.